Average regular monthly wages in Taiwan’s industrial and service sectors rose 2.89 percent year-on-year to NT$47,891 in July, while total compensation — including overtime, commissions and bonuses — climbed 5.48 percent to NT$65,583, the Directorate-General of Budget, Accounting and Statistics (DGBAS) said yesterday.
The median monthly wage, considered a more accurate measure of typical earnings, increased 2.46 percent to NT$38,291, indicating that many workers earned less than the average.
From January to July, the average monthly wage was NT$47,651, up 2.98 percent from the same period last year, the strongest growth in three years, the data showed.
Photo: CNA
Census Department Deputy Director Tan Wen-ling (譚文玲) attributed the rise to a combination of pay increases, a higher minimum wage and longer working hours.
Average overtime in July was 17.1 hours, up 0.9 hours year-on-year — the highest for the month in 15 years, the data showed.
Manufacturers of electronic components recorded an average of 27.7 hours of overtime per worker, the most for July since data collection began in 1980, Tan said.
Despite the gains in the average wage, the median wage has lagged, underscoring persistent wage concentration and a large share of workers earning below the mean, she said.
High-income earners are driving much of the growth in the average wage, while factors such as the proportion of new hires, job distribution and lower-wage employment limit median wage growth, she added.
Industries with average regular wages below the overall level include accommodation and food services at NT$34,977, as well as other services such as beauty and hairdressing at NT$36,598, the data showed.
Industries such as professional, scientific and technical services (NT$58,109); the information and communications, publishing and audiovisual sectors (NT$69,407); and the financial and insurance sector (NT$70,749) recorded relatively high wages.
With inflation moderating, the rise in the average wage has partially offset price pressures, boosting real purchasing power, although wage inequality remains a concern, Tan said.
The consumer price index has been within the central bank’s 2 percent target for four consecutive months, supported by the appreciation of the New Taiwan dollar.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It