Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) received about NT$147 billion (US$4.71 billion) in subsidies from the US, Japanese, German and Chinese governments over the past two years for its global expansion.
Financial data compiled by the world’s largest contract chipmaker showed the company secured NT$4.77 billion in subsidies from the governments in the third quarter, bringing the total for the first three quarters of the year to about NT$71.9 billion.
Along with the NT$75.16 billion in financial aid TSMC received last year, the chipmaker obtained NT$147 billion in subsidies in almost two years, the data showed.
Photo: Bloomberg
The subsidies received by its subsidiaries — TSMC Arizona Corp in the US; European Semiconductor Manufacturing Co in Dresden, Germany; Japan Advanced Semiconductor Manufacturing Inc in Kumamoto Prefecture; and TSMC Nanjing Co in China’s Jiangsu Province — were largely used for purchasing property, facilities and equipment, TSMC said.
In addition, the funds were also allocated to operating costs and expenses associated with the overseas production sites, the company said.
Under the agreements the four subsidiaries signed with local governments, TSMC must follow the schedules set to complete the construction and observe other terms in its investments, it said.
In Arizona, TSMC is also eligible to apply for aid, representing 25 percent of certain investments in the US state.
TSMC is investing US$65 billion to build three advanced fabs in Arizona, with mass production of the first started in the fourth quarter of last year. The company has pledged to invest an additional US$100 billion in the US state to build three more fabs, two chip packaging plants and one research and development center.
In Kumamoto, TSMC’s first fab began commercial production at the end of last year, and construction of the second is under way. In Dresden, the chipmaker is also building a chip plant, with its mass-production timeline depending on customer demand and market conditions.
In Nanjing, TSMC runs a 12-inch wafer fab, which put the mature 28-nanometer process into production in 2022.
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