Yageo Corp (國巨), the world’s third-largest supplier of multilayer ceramic capacitors, has formed a strategic alliance with Hon Hai Precision Industry Co (鴻海精密) to develop key electronic components for electric vehicles and digital healthcare, it said yesterday.
The alliance is to help Yageo boost its revenue from high-end components for vehicles and industrial, medical and aerospace devices, as well as those used in 5G and Internet-of-Things devices, the company said.
The companies signed the strategic alliance agreement at Yageo’s headquarters in New Taipei City’s Sindian District (新店).
Photo courtesy of Yageo Corp
Their cooperation is to start this quarter, the companies said in a joint statement.
“Through the cooperation with Hon Hai, we are able to enlarge our mutual technological benefits and resource sharing to maximize the value of both groups and see multiple growths in the future,” Yageo chairman Pierre Chen (陳泰銘) said.
The passive components maker would invest resources in advancing new technology development platforms for Hon Hai to provide customized and advanced electronic components primarily used in electric vehicles, medical treatment, artificial intelligence, robots and 5G devices.
The combination of global production, and operational and technical capabilities of high-end key electronic components would provide them win-win results and create even higher value, the statement said.
Yageo would not only focus on supplying the high-end 5G, automotive, industrial, aerospace and medical segments, but also provide its expertise and one-stop shopping platform for special semiconductor packaging and testing services, following a series of mergers and acquisitions, such as Fort Lauderdale, Florida-based Kemet Corp, it said.
“Through this strategic alliance, we will focus more on the development of new customers and products with joint resources to meet global customers’ needs in supporting the supply chain and functional design development, and come up with more value-added solutions,” Hon Hai chairman Young Liu (劉揚偉) said in the statement.
Yageo has 15 design and research and development centers and 42 manufacturing sites around the world and is a provider of quality design-in services.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
RSS