Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) listed the challenges of ensuring export control compliance by its customers, months after the company’s artificial intelligence (AI) silicon was found to have flowed to US-sanctioned Huawei Technologies Co (華為) via intermediaries.
“TSMC’s role in the semiconductor supply chain inherently limits its visibility and information available to it regarding the downstream use or user of final products that incorporate semiconductors manufactured by it,” the Hsinchu-based company said in its latest annual report released on Friday.
The world’s largest contract chipmaker said the constraint impedes its ability to prevent unintended end-uses of its semiconductors, as well as diverted shipments by business partners and third parties intent on circumventing sanctions.
Photo: Ann Wang, Reuters
In terms of whether there are going to be compliance issues found, the go-to chipmaker for Apple Inc and Nvidia Corp in the report said there is “no assurance,” despite TSMC’s best efforts to abide by relevant export control regulations.
TSMC provides manufacturing services to many so-called fabless firms and chip designers, including Nvidia. Very often, the semiconductors it customizes for those companies end up being incorporated in gadgets and devices made by third parties, most often for legitimate purposes.
For instance, Qualcomm Inc and MediaTek Inc (聯發科) work with TSMC to make mobile chips used by phone makers, including Xiaomi Corp (小米).
However, an investigation by Canada-based research firm TechInsights last year showed that Huawei’s Ascend 910B AI chip contained semiconductors by TSMC.
The chipmaker halted shipments to a client at about the same time after it found out the semiconductors it made for the customer ended up with Huawei.
TSMC alluded to the incident in the annual report and said it notified Washington and Taipei in October last year that a chip it made for a customer might have been diverted to a restricted entity.
The chipmaker added that it has been cooperating with authorities’ requests for additional information and documents.
US President Donald Trump’s administration has followed the footsteps of former US president Joe Biden in curbing the flow of advanced technologies to China out of national security concerns.
The US earlier this month unveiled a fresh round of regulations to tighten China’s access to advanced AI chips.
Earlier this year, Washington called for chip producers like TSMC and Samsung Electronics Co to step up their scrutiny and due diligence of customers, especially Chinese firms. US officials simultaneously blacklisted 16 Chinese companies including Sophgo Technologies Ltd (算能科技), which was allegedly involved in Huawei getting access to TSMC chips last year.
Together with Sophgo, the US also added PowerAir Pte Ltd to the entity list after the South China Morning Post reported concerns about the Singapore-based company’s possible involvement in diverting TSMC chips to Huawei.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass