TEMICO Motor India Pvt Ltd has obtained powertrain orders from major Indian electric vehicle (EV) manufacturers, its parent company Teco Electric & Machinery Co (東元電機) said in a statement yesterday.
TEMICO is to supply 5,000 9m and 12m electric bus direct-drive powertrains and 50,000 light commercial vehicle powertrains, as part of its three-year contract, the statement said.
Delivery of the powertrains is expected to begin in the first quarter of next year, it said.
Photo courtesy of Teco Electric & Machinery Co
Financial terms of the deal were not disclosed.
TEMICO is a joint venture established by Teco and Japan’s Mitsui & Co in 2020 to supply high-efficiency industrial motors and powertrain systems for EVs in India. Located in Bengaluru in southern India, TEMICO began trial runs of its production line for EV powertrains at the end of November last year.
It is expected to start mass production after gaining certification from the Bureau of Indian Standards next month, the firm said.
“This large order for EV powertrains marks an important breakthrough for Teco in the Indian market,” Teco chairman Morris Li (利明献) said.
Li was elected, unopposed, as Teco chairman during a board meeting on May 31, succeeding Sophia Chiu (邱純枝). Chiu was promoted to vice chairwoman of Teco Group (東元集團).
Following the rapid growth of the Indian EV market and to cope with Indian Prime Minister Narendra Modi’s “Make in India” policy, Teco aims to expand local operations and increase market share in the South Asian nation, Li said.
After starting the mass production of EV powertrains later year, TEMICO expects to become the second company in India that can produce electric bus powertrains locally, as there is only one such manufacturer currently, George Lien (連昭志), a board director of TEMICO, said in the statement.
Teco has focused heavily on manufacturing powertrains for electric buses at its home market, but the scale of the Indian market is more attractive to the company, Lien said.
The Indian electric bus market is expected to expand significantly, as Modi’s government plans to replace 800,000 diesel-powered buses across the nation with electric buses by 2030, and New Delhi has launched preferential policies to increase efficiency and achieve decarbonization in public transportation systems, he said.
TEMICO has continued to talk with other bus manufacturers in India, as it strives to become an important electric bus powertrain supplier, Lien said.
The company has a positive outlook regarding its EV powertrain and charging pile business in India, China and North America, as those markets have shown signs of a stable demand, he added.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass