Lenovo picks MediaTek chips
MediaTek Inc (聯發科), the nation’s biggest handset chip designer, said China’s PC brand Lenovo Group Ltd (聯想) has picked its chips for Lenovo’s latest tablet running on the Android system.
Lenovo will use MediaTek’s MT6575 and MT6620 Android chips in its new tablet, according to a statement released by MediaTek on Thursday. The chips are currently used by many of MediaTek’s leading customers in their latest smartphone and tablet offerings, the Taiwanese firm said.
MediaTek’s mobile platform would help mobile device manufacturers, such as Lenovo, to address the mid-range and entry-level tablets. Gartner Inc forecast global tablet shipments would grow to 494 million units in 2016 from this year’s 119 million units.
Real-estate tops NT$218 billion
The volume of presale real-estate projects in northern Taiwan for the Sept. 28 promotional season starting this weekend totals NT$218.9 billion (US$7 billion), a new eight-year high, according to the latest survey by Chinese-language MyHousing magazine.
New Taipei City (新北市) leads the northern region with NT$92.1 billion in volume, followed by NT$49.4 billion in Hsinchu and NT$43.6 billion in Taipei City, according to the survey.
Cathay acquires China offices
Cathay Life Insurance Co (國泰人壽), the nation’s largest insurance company by market share, has acquired five floors of an office building in Shanghai for NT$3.18 billion at NT$883,300 per ping (3.3m2), marking the first real-estate investment by Taiwanese insurers in China, the Chinese-language Economic Daily News reported yesterday.
The life insurer, the flagship company of Cathay Financial Holding Co (國泰金控), will use the space as its headquarters in China, the newspaper said. More Taiwanese insurers are expected to follow Cathay Life in their bids to acquire real estate in China, if the Financial Supervisory Commission loosens restrictions on insurers’ cross-strait property investments, the report said.
Solar firms anticipate orders
Taiwanese solar product manufacturers at a solar energy fair in the US were expected to secure more than US$10 million in orders, the Taiwan External Trade Development Council (TAITRA, 外貿協會) said on Thursday. Operating at 22 booths, the 14 Taiwanese companies at Solar Power International 2012 at the Orange County Convention Center in Florida displayed products such as solar power generation systems, polycrystalline silicon cell chips, solar modules and connectors, the TAITRA said.
Taiwanese participants included photovoltaic system component maker Topper Sun Energy Technology Co (上陽), solar module suppliers Ablytek Co (綠晁) and Tynsolar Corp (頂晶), the council said.
Lenovo names GM for Taiwan
Lenovo Group Ltd (聯想) announced yesterday it had named Jack Lee (李世傑) as general manager for operations in Hong Kong, Taiwan and South Korea, with the appointment taking effect on Oct. 1.
Lee will report to Milko van Duijl, president for the Asia-Pacific and Latin America regions at Lenovo Group, the company said in a statement. Lee currently serves as vice president at Lenovo Group. Prior to this position, he was general manager for Lenovo’s operations in the Middle East and Africa.
NT dollar gains on greenback
The New Taiwan dollar rose against the US dollar yesterday, adding NT$0.23 to close at NT$29.469.
Turnover totaled US$1.05 billion during the trading session.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
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