The nation’s global competitiveness ranking remained unchanged at No. 13 this year, supported by strong business innovation and improving financial market developments, despite weak labor market efficiency and worsening government finances, a report by the World Economic Forum (WEF) showed yesterday.
The Global Competitiveness Report 2011-2012 by the Geneva-based independent organization ranked Switzerland as the most competitive among 142 economies, followed by Singapore, Sweden, Finland and the US.
Regionally, Taiwan ranked fourth behind Singapore, Japan and Hong Kong, but outperformed South Korea. Japan ranked ninth, while Hong Kong and South Korea were at No. 11 and No. 24 respectively, the report said.
Countries are evaluated based on 111 factors that fall under 12 main categories: institutions, infrastructure, macroeconomic environment, health and primary education, higher education and training, goods market efficiency, labor market efficiency, financial market development, technological readiness, market size, business sophistication and innovation.
“The study showed that Taiwan placed first in eight detailed factors, with 37 of its factors marking their highest levels in history, an indication that the nation’s global competitiveness remains strong,” Council for Economic Planning and Development Minister Christina Liu (劉憶如) told a media briefing.
Taiwan placed first in utility patents granted — the fourth straight year it topped the list — demonstrating local companies’ continuing efforts on innovation, Liu said, citing the WEF’s statement.
In terms of financial market development, Taiwan moved up 11 notches to No. 24, with affordability of financial services and financing through local equity market ranking first and second respectively.
However, Taiwan ranked 118th in “rigidity of employment index” and “redundancy costs,” indications that labor market efficiency remained an important issue for the nation.
“The government should carefully consider how to balance the flexibility between the employers and employees,” Liu said.
The government budget balance ranked No. 91, down from No. 68 a year earlier, with the ranking of general government debt dropping five notches to 71st. Both factors were a drag on the nation’s macroeconomic environment, the report said.
Liu attributed these worsening rankings to the government’s strategy of spurring domestic demand by granting consumption vouchers in 2009, as the WEF said in the report that the evaluations on government finance were made based on 2009 data.
“These rankings may rebound next year, further driving up the nation’s overall global competitiveness ranking,” she said.
The Ministry of Finance published the latest Web-based “National Debt Clock” yesterday, with the national debt working out to NT$204,000 per person as of the end of last month, down NT$1,000 per person from a month earlier.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome