Heterogeneous integration and silicon photonics have become the main focus of the global semiconductor industry, according to experts who observed this year’s Semicon Taiwan trade show, which concluded earlier this month.
This year’s event highlighted artificial intelligence (AI) applications, which are driving innovations and integration across the semiconductor supply chain — from advanced chip production processes to integrated circuit (IC) packaging and testing, smart manufacturing and talent cultivation, Arisa Liu (劉佩真), a researcher at the Taiwan Institute of Economic Research’s (TIER) Taiwan Industry Economics Database, told CNA over the weekend.
Liu said heterogeneous integration — the process of combining multiple types of components, such as logic chips, memory, sensors, photonics and radio frequency modules, into a single compact system — was one of the major themes at this year’s show, as the industry works to build more powerful and efficient AI chips by integrating technologies with different functions.
Photo: CNA
In addition, Liu said traditional electronic signal transmission cannot meet the massive data-processing demands of the AI era, but that silicon photonics can meet those demands.
“Heterogeneous integration and silicon photonics have become the critical and strategic technologies of future semiconductor development,” Liu said. “Taiwan is expected to continue to play a key part in these important technologies by taking advantage of its advanced pure play wafer processes and IC assembly and packaging services,” she said.
Currently, Taiwan Semiconductor Manufacturing Co (台積電) is the global leader in the pure play wafer business, and ASE Technology Holding Co (日月光) holds the top spot in IC packaging and testing.
This year, Semicon Taiwan reported a record 1,200 exhibitors and more than 100,000 visitors.
According to the event’s organizer SEMI, next year’s event will take place on Sept. 2-4 and is expected to smash the records.
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