Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) revenue rose to a record in the first quarter on demand for chips used in smartphones, computers and vehicles, while a prolonged shortage helped to boost prices.
Revenue jumped 36 percent to NT$491.1 billion (US$17 billion) in the first quarter, the company said in a statement yesterday.
Analysts estimated NT$469.4 billion on average.
Photo: Cheng I-hwa, Bloomberg
Demand for mobile phones, smart televisions and other gadgets from makers such as Apple Inc and Samsung Electronics Co remains robust even as consumers in major markets in Europe and the US exit COVID-19 pandemic-era lockdowns and work-from-home arrangements.
Meanwhile, a chip shortage is yet to ease — the wait times for semiconductor delivery grew again last month due to China’s COVID-19 lockdowns and an earthquake in Japan that hit production, research by Susquehanna Financial Group said.
TSMC has kept production running in China, even as many other factories suspended operations to cope with the local pandemic policy. The chip assembler said at the end of last month that it would rearrange production priorities to deal with a shift in demand caused by COVID-19 restrictions in Shanghai and Shenzhen.
TSMC was not planning to revise down its sales and capital spending forecasts for this year, chairman Mark Liu (劉德音) said at the time.
Shares of TSMC have lost about 8 percent this year, hurt by a broader decline in global technology stocks and China’s lockdowns, which have weighed on consumer demand and affected supply chains. The stock advanced 0.2 percent yesterday ahead of the company’s report.
Separately, contract chipmaker United Microelectronics Corp (UMC, 聯電) yesterday said revenue soared 34.66 percent last quarter to a new record high of NT$63.42 billion, compared with NT$47.1 billion in the same period last year.
On a quarterly basis, revenue expanded 7.31 percent, slightly better than the chipmaker’s expectations.
UMC expected revenue to rise about 5 percent sequentially, primarily due to price hikes, citing strong chip demand from makers of vehicles, Internet-of-Things devices and display drivers.
UMC forecast that revenue growth this year would outstrip the foundry’s sector projected growth of 20 percent in a best-case scenario.
Additional reporting by Lisa Wang
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass