Hewlett-Packard Co (HP) is narrowing its focus to the traditional notebook market, despite the recent successes of Acer Inc(宏碁)and AsusTek Computer Inc(華碩電腦)with netbooks, a company official said.
“The competition in the netbook sphere is extremely intense. There’s very little margin in that category, and we at HP believe the recent netbook frenzy is due to the back-to-school season, when kids are buying laptops for school,” Clair Chang (張淑雯), manager of HP Taiwan’s product marketing department, said at a media briefing.
“As the market normalizes, we see more and more consumers going back to quality traditional notebooks. And traditional notebooks will be our company focus going forward,” Chang said yesterday as the company introduced a suite of Elitebook-brand models targeted at business users.
Asked about what effect the concentrated strategic move would have on its global sales target this year, Chang said HP’s corporate sales target has not been revised downward, despite the global economic slowdown.
Moreover, she said, HP will continue to be the world’s No. 1 computer vendor this year.
HP plans to release its second generation of Mini-Note models before the end of the year. The company declined to say how many models it expects to ship or what the specifications of the new generation would be.
HP’s new Elitebook series was inspired by aircraft engineering and features a magnesium alloy chassis designed to operate in a variety of working conditions, said Monty Wong (王漢彪), vice president and manager of HP’s personal computing systems group.
Elitebook prices range from NT$65,900 to NT$99,900.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
RSS