Compal Electronics Inc (
Compal will buy 26.6 million shares at NT$37 per share for a 69 percent stake in Arcadyan Technology Corp (
The deal was approved by the two companies' boards of directors yesterday.
"Compal will be able to create a complete wireless communications business by integrating resources with Arcadyan," the statement said.
The new business will move into the areas of digital multimedia home applications and dual-mode phones by utilizing Arcadyan's Internet protocol technology, Compal said.
It is now commonplace for laptops to have built-in wireless communications features, resulting in increased collaboration between notebook computer vendors and wireless technology companies, according to the statement.
The partnership would ensure ample wireless module supplies for laptop computer makers, while at the same time helping the firm to enlarge its client base and introduce new products, Compal said.
Compal will reduce its holding in Arcadyan to 60 percent after distributing shares to employees, with the remaining shares to be held by Accton. Arcadyan will probably hold an initial public offering within two years, the companies said.
Ray Chen (
Although the company projected a rosy outlook for its notebook shipments in the second half of the year, its gross margin in the second quarter dipped below 5 percent for the first time to 4.7 percent, compared with 6.2 percent a year ago.
Chen said on April 26 that Compal would leverage mergers and acquisitions to move into new areas such as wireless communications, digital home entertainment, automotive electronics and portable media devices.
"Our product diversification is still in its infancy ... without major mergers, this segment will probably contribute a single-digit percentage to our revenues this year," he said at the time.
Currently, notebook computers account for 90 percent of Compal's sales, with the remainder contributed by non-core business such as liquid-crystal-display televisions and monitors, wireless products and portable media players.
The firm said earlier this month it expected its non-notebook segments to account for 20 percent of total sales by 2008.
Compal reported profit of NT$8.42 billion on sales of NT$266 billion last year, while Accton Technology posted a loss of NT$302 million last year on sales of NT$18.3 billion.
Shares of Compal closed down 0.2 percent to close at NT$27.95 yesterday on the Taiwan Stock Exchange, while shares of Accton were up 1.7 percent to NT$18.2.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome
RSS