The 13th Taipei International Book Exhibition (TIBE), sponsored by the Government Information Office, is slated to open tomorrow at the Taipei World Trade Center (TWTC).
The annual event will feature a series of exhibitions and discussions that reflect reading activities and trends in the Asia-Pacific region, according to the organizer, the private Taipei Book Fair Foundation.
During the book fair, two major reading trends will be highlighted: "book art" and "digital publishing."
The TIBE 2005 will take place at three different TWTC halls, with Hall I divided into five major sections -- international publishers and their publications; general books; books of special interest; and assorted magazines featuring business, finance, digital content, popular culture and lifestyle.
Hall II will be dedicated to comic books to accommodate domestic and foreign publishers, while Hall III will be devoted to children's books and will include 400 booths displaying works from both Taiwan and abroad, according to the organizer.
Halls I and III will be open only to professional visitors tomorrow and Wednesday, but the public can take part in the activities in Hall II throughout the event and in Halls I and III from Thursday. The show will run until Feb. 20.
Meanwhile, to celebrate the book festival, two major chain bookstore operators in Taiwan -- Eslite and Kingstone -- have already launched "fun reading book fairs" at their 20 branches across the island prior to the TIBE 2005 opening.
Taipei Book Fair Foundation Chairman Rex How said yesterday that the bookstore activities, which began on Feb. 1 and will run until Feb. 28, are not only warm-ups for the exhibition but also an effort to promote the upcoming TIBE at bookstores around the country.
The effort is aimed at boosting a nationwide reading atmosphere, How said, adding that he hopes those who live in townships and villages outside of Taipei City and not able to visit the TIBE 2005 can still feel the book-fair atmosphere and buy books with the same discounts that book-fair visitors will enjoy.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
RSS