Wiwynn Corp (緯穎科技) and Compal Electronics Inc (仁寶) were approved on Wednesday to invest a total of US$900 million in the US and Mexico to expand their manufacturing capacity for servers or cloud-based data centers, the Ministry of Economic Affairs said in a statement.
Wiwynn, a server manufacturing arm of Wistron Corp (緯創) and a supplier of Nvidia Corp’s server racks, plans to invest US$220 million into its Mexican unit to boost cloud-based data center and data storage capacity, the ministry said.
The company plans to finance its US unit, Wiwynn Technology Corp, with an additional US$250 million, it added.
Photo: Liao Chia-ning, Taipei Times
Contract notebook computer maker Compal plans to invest US$425 million in its US unit, Compal USA Technology Inc, to build its first server manufacturing plants there, the ministry said.
Compal, which lags behind its local peers in tapping into the server market, plans to build its first US manufacturing hub in Taylor, Texas. It has leased a manufacturing facility for US$65.67 million and expects to begin volume production in the second half of this year.
The company plans to set up a server after-sales and maintenance service center for US$28.43 million in Georgetown, Texas, to support enterprise and cloud-based infrastructure demand.
Other outbound investment applications approved by the ministry on Wednesday included Lite-On Technology Corp’s (光寶科技) US$200 million investment in its Vietnamese unit to produce power supply units for server modules and consumer electronics, CTCI Development Corp’s (興利開發) US$200 million investment in its US unit’s construction projects and Techman Robot Inc’s (達明機器人)
US$100 million investment in a
British Virgin Islands-based investment fund for foreign exchange hedging.
Merry Electronics Co (美律) gained approval to invest US$68.34 million to acquire Japan’s MWT Holdings Co for production of components used in ear pods and earplugs, Bank SinoPac (永豐銀行) received permission to invest US$50 million in its Ho Chi Minh City branch, and Walsin Lihwa Corp (華新麗華) was greenlit to invest US$15 million in its Chinese branch, the ministry said.
GROWING OWINGS: While Luxembourg and China swapped the top three spots, the US continued to be the largest exposure for Taiwan for the 41st consecutive quarter The US remained the largest debtor nation to Taiwan’s banking sector for the 41st consecutive quarter at the end of September, after local banks’ exposure to the US market rose more than 2 percent from three months earlier, the central bank said. Exposure to the US increased to US$198.896 billion, up US$4.026 billion, or 2.07 percent, from US$194.87 billion in the previous quarter, data released by the central bank showed on Friday. Of the increase, about US$1.4 billion came from banks’ investments in securitized products and interbank loans in the US, while another US$2.6 billion stemmed from trust assets, including mutual funds,
Micron Memory Taiwan Co (台灣美光), a subsidiary of US memorychip maker Micron Technology Inc, has been granted a NT$4.7 billion (US$149.5 million) subsidy under the Ministry of Economic Affairs A+ Corporate Innovation and R&D Enhancement program, the ministry said yesterday. The US memorychip maker’s program aims to back the development of high-performance and high-bandwidth memory chips with a total budget of NT$11.75 billion, the ministry said. Aside from the government funding, Micron is to inject the remaining investment of NT$7.06 billion as the company applied to participate the government’s Global Innovation Partnership Program to deepen technology cooperation, a ministry official told the
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), the world’s leading advanced chipmaker, officially began volume production of its 2-nanometer chips in the fourth quarter of this year, according to a recent update on the company’s Web site. The low-key announcement confirms that TSMC, the go-to chipmaker for artificial intelligence (AI) hardware providers Nvidia Corp and iPhone maker Apple Inc, met its original roadmap for the next-generation technology. Production is currently centered at Fab 22 in Kaohsiung, utilizing the company’s first-generation nanosheet transistor technology. The new architecture achieves “full-node strides in performance and power consumption,” TSMC said. The company described the 2nm process as
JOINT EFFORTS: MediaTek would partner with Denso to develop custom chips to support the car-part specialist company’s driver-assist systems in an expanding market MediaTek Inc (聯發科), the world’s largest mobile phone chip designer, yesterday said it is working closely with Japan’s Denso Corp to build a custom automotive system-on-chip (SoC) solution tailored for advanced driver-assistance systems and cockpit systems, adding another customer to its new application-specific IC (ASIC) business. This effort merges Denso’s automotive-grade safety expertise and deep vehicle integration with MediaTek’s technologies cultivated through the development of Media- Tek’s Dimensity AX, leveraging efficient, high-performance SoCs and artificial intelligence (AI) capabilities to offer a scalable, production-ready platform for next-generation driver assistance, the company said in a statement yesterday. “Through this collaboration, we are bringing two
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