Shares of contract chipmaker Powerchip Semiconductor Manufacturing Corp (力積電) yesterday rose by more than 50 percent on its debut on the Taiwan Stock Exchange (TWSE), buoyed by a rosy outlook for the pure-play wafer foundry industry amid tight global supply, dealers said.
Shares of Powerchip Semiconductor closed at NT$75.90, up 52.1 percent from its issuance price of NT$49.90, helping offset the impact on the local market of US market losses on Friday, when the tech-heavy NASDAQ lost 1.92 percent and the Dow Jones Industrial Average declined 0.17 percent due to disappointing US jobs data, dealers said.
Newly listed stock in Taiwan is not restricted by the maximum daily increase or decrease of 10 percent during its first five trading sessions.
Photo: Grace Hung, Taipei Times
Soon after the local equity market opened, Powerchip Semiconductor’s stock price rose 56.31 percent. Its strong showing continued until the end of the session, as investors took their cues from the company’s strong bottom line in the first nine months of this year.
In the first nine months, Powerchip Semiconductor posted a record NT$9.89 billion in net profit, with earnings per share (EPS) of NT$3.07.
Analysts expect its EPS for the whole year to hit NT$4.50 on the back of a robust fourth quarter.
Powerchip Semiconductor generated NT$58.75 billion (US$2.12 billion) in consolidated sales for the first 11 months, up 40.76 percent year-on-year, because the global market did not have enough supply to meet demand.
Powerchip Semiconductor, one of four contract chipmakers in Taiwan, specializes in mature technologies. It owns two 8-inch wafer fabs with a monthly capacity of 110,000 units and three 12-inch wafer plants with a monthly capacity of 110,000 units.
The other three contract chipmakers are Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) — the world’s largest with a share of more than 50 percent of the global market — United Microelectronics Corp (UMC, 聯電) and Vanguard International Semiconductor Corp (世界先進).
Powerchip Semiconductor is the sixth-largest contract chipmaker in the world and the third-largest in Taiwan after TSMC and UMC, company chairman Frank Huang (黃崇仁) said at its initial public offering (IPO) ceremony yesterday.
Huang said he has high hopes that Powerchip Semiconductor will soon become the fifth-largest contract chipmaker in the world, citing orders that the company has secured.
Powerchip Semiconductor’s predecessor was Powerchip Technology Corp (力晶科技), a DRAM supplier that experienced heavy losses in a DRAM cyclical downturn in 2012. Huang was the company’s chief executive officer.
The DRAM maker sold its assets to US-based Micron Technology Inc and delisted from the TWSE in December 2012.
Huang oversaw the restructuring of Powerchip Technology, which transformed into a pure-play wafer foundry business that produced driver ICs for flat panels, imaging processors and power management chips, enabling it to repay its bank loan of NT$120 billion and turn a profit.
Powerchip Technology then spun off its pure-play wafer foundry business, which became Powerchip Semiconductor.
According to the contract chipmaker, its major clients have rushed to sign long-term contracts to secure supplies and deflect the impact of the current supply shortage.
The TWSE said that Powerchip Semiconductor’s robust showing resulted in its market capitalization hitting NT$258.82 billion, the highest figure among all firms that have launched an IPO on the main board in the past three years.
Through the IPO, the company has raised enough to build its planned NT$100 billion plant in Miaoli County, Huang said.
Shares of contract chipmaker Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) came under pressure yesterday after a report that Apple Inc is looking to shift some orders from the Taiwanese company to Intel Corp. TSMC shares fell NT$55, or 2.4 percent, to close at NT$2,235 on the local main board, Taiwan Stock Exchange data showed. Despite the losses, TSMC is expected to continue to benefit from sound fundamentals, as it maintains a lead over its peers in high-end process development, analysts said. “The selling was a knee-jerk reaction to an Intel-Apple report over the weekend,” Mega International Investment Services Corp (兆豐國際投顧) analyst Alex Huang
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is expected to remain Apple Inc’s primary chip manufacturing partner despite reports that Apple could shift some orders to Intel Corp, industry experts said yesterday. The comments came after The Wall Street Journal reported on Friday that Apple and Intel had reached a preliminary agreement following more than a year of negotiations for Intel to manufacture some chips for Apple devices. Taiwan Institute of Economic Research (台灣經濟研究院) economist Arisa Liu (劉佩真) said TSMC’s advanced packaging technologies, including integrated fan-out and chip-on-wafer-on-substrate, remain critical to the performance of Apple’s A-series and M-series chips. She said Intel and Samsung
TRANSITION: With the closure, the company would reorganize its Taiwanese unit to a sales and service-focused model, Bridgestone said Bridgestone Corp yesterday announced it would cease manufacturing operations at its tire plant in Hsinchu County’s Hukou Township (湖口), affecting more than 500 workers. Bridgestone Taiwan Co (台灣普利司通) said in a statement that the decision was based on the Tokyo-based tire maker’s adjustments to its global operational strategy and long-term market development considerations. The Taiwanese unit would be reorganized as part of the closure, effective yesterday, and all related production activities would be concluded, the statement said. Under the plan, Bridgestone would continue to deepen its presence in the Taiwanese market, while transitioning to a sales and service-focused business model, it added. The Hsinchu
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has approved a capital budget of US$31.28 billion for production expansion to meet long-term development needs during the artificial intelligence (AI) boom. The company’s board meeting yesterday approved the capital appropriation plan for purposes such as the installation of advanced technology capacity and fab construction, the world’s largest contract chipmaker said in a statement. At an earnings conference last month, TSMC forecast that its capital expenditure for this year would be at the higher end of the US$52 billion to US$56 billion range it forecast in January in response to robust demand for 5G, AI and