EQUITIES
TAIEX closes above 11,000
Local shares yesterday moved higher, closing above 11,000 points on the back of an overnight rally in US markets, as investors embraced expectations that businesses would reopen and the development of a COVID-19 vaccine by US-based Novavax Inc. However, the upturn was limited, with some investors shifting into sell mode after Washington reacted to security laws proposed by China to tighten control over Hong Kong, dealers said. The TAIEX ended up 17.45 points, or 0.16 percent, at 11,014.66 on turnover of NT$156.24 billion (US$5.2 billion). Foreign institutional investors bought a net NT$332 million of shares on the main board, Taiwan Stock Exchange data showed. After breaking 11,000, the TAIEX might need to consolidate, analysts said.
CHIPMAKERS
Macronix approves dividend
Memorychip maker Macronix International Co (旺宏電子), which claims 23.8 percent of the world’s NOR flash memory market, yesterday said that shareholders at an annual general meeting approved a proposal to pay a cash dividend of NT$1.2 per common share. The distribution represents a 3.55 percent dividend yield based on the stock’s closing price of NT$33.85 yesterday in Taipei. Shareholders also approved NT$544.33 million in compensation for employees and NT$72.58 million for the board directors, as well as a proposal to raise funds by issuing up to 360 million common shares, the firm said.
CHIPMAKERS
Powerchip takes new head
Foundry and memorychip maker Powerchip Semiconductor Manufacturing Corp (力積電) yesterday said that it has tapped former AP Memory Technology Corp (愛普科技) president Gu Jun (顧峻) as the new copresident of its memory business group in a bid to enhance its research and development. Gu worked at Intel Corp and Cypress Semiconductor Corp before joining AP Memory in 2011. Chief technology officer Chang Shou-ren (張守仁) has also been promoted to vice president, it said, adding that the changes take effect on Monday next week.
ENERGY
Wpd’s deal to limit bird loss
Offshore wind energy developer Wpd Taiwan Energy Co Ltd (達德能源) yesterday signed a contract worth nearly NT$70 million with WeatherRisk Explore Inc (天氣風險) to monitor bird activity around Wpd’s planned 640 megawatt (MW) wind farm in Yunlin County and help minimize the project’s impact on bird migration. Surveillance equipment such as cameras and microphones would be installed on the transitional wind turbines, with radars to be preinstalled on the turbine components, Wpd said. The wind farm’s 80 8MW wind turbines are to be completed by the end of next year.
BUILDING SERVICES
FDC to help TCC (Hangzhou)
TCC (Hangzhou) Environmental Protection Technology Co Ltd (台泥環保科技), a wholly owned subsidiary of Taiwan Cement Corp (台灣水泥), yesterday signed a deal covering management services, marketing and trademark licensing with FDC International Hotels Corp (雲品國際). Under the agreement, FDC would assist TCC (Hangzhou) in planning technical assistance and services for the parent company’s new building in Hangzhou, China, Taiwan Cement said in a statement. TCC (Hangzhou) would also entrust FDC assisting in operating and managing the building, it added. FDC said that it would provide TCC (Hangzhou) with marketing services and license it to use its trademark. FDC is part of the TCC Group (台泥集團).
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
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