The French economy is expected to contract a worse-than-expected 8 percent this year, reflecting the effects of a coronavirus lockdown extended until May 11, French Minister of the Economy and Finance Bruno Le Maire said yesterday.
Le Maire had previously forecast a 6 percent decline in GDP for this year, but that was based on a lockdown that lasted one month, instead of the two-month period announced by French President Emmanuel Macron in a televised address on Monday.
Le Maire told BFM television that the 8 percent forecast would be included in a new budget for this year set to be unveiled this week, but added that given the uncertain outlook for economies around the world, not least in the US and Asia, “these forecasts need to be considered with caution.”
Photo: AFP
A massive relief effort for bars, restaurants, hotels, shops and other businesses closed during the lockdown would push France’s budget deficit up to 9 percent of GDP this year, French Minister of Public Accounts and Action Gerald Darmanin said separately in an interview with France Info radio.
“Each day, each week of confinement ... is worsening our public finances,” he said, adding that France’s debt pile would soar to 115 percent of GDP, up from just under 100 percent last year.
Both forecasts are well above the limits set by the EU’s Stability and Growth Pact, which calls for deficits to be capped at 3 percent of GDP and a debt-to-GDP ratio of 60 percent.
However, EU officials have signaled that the rules are to be suspended as governments scramble to contain the economic fallout, and prevent mass bankruptcies and layoffs.
Le Maire said that government aid for smaller companies at risk of going under, after losing at least 50 percent of their revenue, would be raised to as much as 5,000 euros (US$5,466), up from 1,500 euros previously.
The total amount of the rescue fund totals 7 billion euros, he said.
Economists have said that the EU is heading for a double-digit percentage slump in the first half of this year amid widespread lockdowns.
A monthly survey by Bloomberg puts the contraction in the eurozone at more than 10 percent in the January-to-June period, with most of the hit — 8.3 percent — in the second quarter.
Even with an expected rebound later in the year, the bloc’s output is likely to decline more than 5 percent this year.
The Bloomberg survey shows widespread damage to eurozone economies this quarter, with Germany likely contracting 7.6 percent, Italy 8.8 percent, Spain 10 percent and the UK nearly 12 percent.
The timing of any rebound depends on when restrictions on movement, gatherings and businesses are lifted, or at least eased.
While some governments have indicated that they expect to relax some rules, the rapid spread of the virus so far suggests a return of normality remains a distant prospect.
Additional reporting by Bloomberg
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass