The Ministry of Economic Affairs is planning a comprehensive price-making mechanism for utilities by year's end before possible markups for water and electricity rates come into force, incoming Ministry of Economic Affairs Vice Minister Hou Ho-hsiung (
"We hope to unveil thorough price-making formulas and a reassessment of water and electricity rates and gasoline prices by the end of this year," Hou said on the sidelines of his inauguration ceremony yesterday.
The ministry has asked the state-run Chinese Petroleum Corp (CPC,
"Oil prices are a more urgent issue," Hou said when asked about the state oil refiner's possible price hike. "In the meantime, the ministry will continue monitoring the movement of the price of crude oil, which has declined recently."
The price of CPC oil has been much lower than skyrocketing crude-oil prices but has still been profitable, Hou said, adding that the ministry was seeking to balance the firm's profitability in an environment of rising costs and public expectations.
The refinery created pre-tax income of NT$16.2 billion (US$500 million) in the first seven months of this year, way ahead of its regulatory pre-tax income of NT$14.9 billion for this year, according to figures from the ministry's Enterprise Commission.
Hou, 61, yesterday formally replaced Yin Chi-ming (
With his expertise in water-resources engineering, Hou will oversee water resources-related units -- the Water Resources Agency and Taiwan Water Corp (
Hou will have to deal with thorny issues such as adjustments to gasoline and electricity rates, water supply from the Shihmen Reservoir in Taoyuan and the proposed eight-year NT$80 billion flood-control bill.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome