Qualcomm Inc yesterday said it is to open three research and testing centers — including a 5G module research and design center in Hsinchu next quarter — in an effort to complete the final pieces of its 5G puzzle.
A millimeter-wave testing center and a biometric sensor testing center will also be built at its campus in Hsinchu, it said.
The US chipmaker added that it plans to relocate several key labs to Taiwan over the next few months, making Taiwan the second in the world after Silicon Valley with testing capabilities for those technologies.
The latest development came after the San Diego, California-based chipmaker in August agreed to invest a total of US$700 million in Taiwan over the next five years to settle an antitrust lawsuit with the Fair Trade Commission.
“We are working together with Taiwan to complete this 5G puzzle at the very beginning phase,” Roawen Chen (陳若文), senior vice president of manufacturing technology and operations at Qualcomm, told reporters.
It would be totally different from Taiwan’s experience in the development of previous generations of wireless communications technology, as local companies entered the market to “fill some of the holes” in the final stage, he said.
“Our aim is to assist Taiwan to usher in the 5G era as rapidly as possible, allowing them to make profits by quickening the time-to-market of their products, rather than relying on scale of economy,” he said.
“The economic scale achieved by Chinese and South Korean rivals will be incomparable until then,” he said.
Qualcomm’s testing centers would help local manufacturers nearly halve the time-to-market of new products compared with the 4G era, Chen said.
The testing centers would not only provide certification for mobile phone components in Taiwan, but also for system testing, or the whole phone, he added.
The creation of a 5G module research and design center would make it possible for Taiwan’s small and medium-sized enterprises to tap into the 5G market, Chen said.
Such 5G modules can be used in different industries, such as automotive devices, Internet of Things, augmented reality and virtual reality, Chen said.
The introduction of 5G modules can help solve the problems and lower the threshold of 5G technology and investments for companies that do not have a scale of 100 million mobile phones a year, he said.
Qualcomm’s manufacturing tech-nology and operations employ a total of 3,000 engineers worldwide, including about 100 in Taiwan.
The firm plans to expand its local headcount significantly over the next four to five years, it said.
GROWING OWINGS: While Luxembourg and China swapped the top three spots, the US continued to be the largest exposure for Taiwan for the 41st consecutive quarter The US remained the largest debtor nation to Taiwan’s banking sector for the 41st consecutive quarter at the end of September, after local banks’ exposure to the US market rose more than 2 percent from three months earlier, the central bank said. Exposure to the US increased to US$198.896 billion, up US$4.026 billion, or 2.07 percent, from US$194.87 billion in the previous quarter, data released by the central bank showed on Friday. Of the increase, about US$1.4 billion came from banks’ investments in securitized products and interbank loans in the US, while another US$2.6 billion stemmed from trust assets, including mutual funds,
Micron Memory Taiwan Co (台灣美光), a subsidiary of US memorychip maker Micron Technology Inc, has been granted a NT$4.7 billion (US$149.5 million) subsidy under the Ministry of Economic Affairs A+ Corporate Innovation and R&D Enhancement program, the ministry said yesterday. The US memorychip maker’s program aims to back the development of high-performance and high-bandwidth memory chips with a total budget of NT$11.75 billion, the ministry said. Aside from the government funding, Micron is to inject the remaining investment of NT$7.06 billion as the company applied to participate the government’s Global Innovation Partnership Program to deepen technology cooperation, a ministry official told the
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), the world’s leading advanced chipmaker, officially began volume production of its 2-nanometer chips in the fourth quarter of this year, according to a recent update on the company’s Web site. The low-key announcement confirms that TSMC, the go-to chipmaker for artificial intelligence (AI) hardware providers Nvidia Corp and iPhone maker Apple Inc, met its original roadmap for the next-generation technology. Production is currently centered at Fab 22 in Kaohsiung, utilizing the company’s first-generation nanosheet transistor technology. The new architecture achieves “full-node strides in performance and power consumption,” TSMC said. The company described the 2nm process as
JOINT EFFORTS: MediaTek would partner with Denso to develop custom chips to support the car-part specialist company’s driver-assist systems in an expanding market MediaTek Inc (聯發科), the world’s largest mobile phone chip designer, yesterday said it is working closely with Japan’s Denso Corp to build a custom automotive system-on-chip (SoC) solution tailored for advanced driver-assistance systems and cockpit systems, adding another customer to its new application-specific IC (ASIC) business. This effort merges Denso’s automotive-grade safety expertise and deep vehicle integration with MediaTek’s technologies cultivated through the development of Media- Tek’s Dimensity AX, leveraging efficient, high-performance SoCs and artificial intelligence (AI) capabilities to offer a scalable, production-ready platform for next-generation driver assistance, the company said in a statement yesterday. “Through this collaboration, we are bringing two