BOOKSTORES
Taitung Eslite to close
Eslite Spectrum Corp (誠品生活), which runs the Eslite bookstore chain (誠品書局) and other businesses in Taiwan and abroad, on Friday said it would close its Taitung store at the end of this month when the lease for the site expires. The announcement comes after the company closed an outlet in Tainan’s Anping District (安平) at the end of last month. The company had previously announced plans to close its landmark 24-hour outlet on Taipei’s Dunhua S Road at the end of next month, when its lease expires, which would reduce the number of outlets in Taiwan to 42.
AIRLINES
CAL delays new flights
China Airlines Ltd (CAL, 中華航空) on Friday announced that it would delay the launch of its flights to Cebu in the Philippines and Chiang Mai in Thailand until October. It pushed back a planned launch date of June 12 for six weekly flights to Cebu until Oct. 1 and postponed the Taiwan Taoyuan International Airport to Chiang Mai route from the original June 23 launch date to Oct. 2 amid concerns over the COVID-19 pandemic, CAL said in a statement.
INVESTMENT
CDFHC unveils dividend
China Development Financial Holding Corp’s (CDFHC, 中華開發金控) board of directors on Friday announced that it would distribute a cash dividend of NT$0.6 per share, which represented a payout ratio of 68.18 percent based on the company’s earnings per share of NT$0.88 last year. The company is the only financial holding firm among its local peers to provide a dividend yield higher than 7 percent — 7.38 percent, based on the stock’s closing price of NT$8.13 on Friday.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome
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