Leotek Corp (光林智能), a lighting and traffic signaling equipment subsidiary of Lite-On Technology Corp (光寶科技), expects revenue this year to surpass last year’s, driven by infrastructure project gains in Taiwan, North America and elsewhere, company president Torrent Chin (金海濤) said yesterday.
Orders for street lighting fixtures and traffic signaling equipment in Taiwan, and in the US, Canada, Mexico and Chile, as well as for products used in parks, campuses and parking lots in Australia, New Zealand, China and Spain are expected to increase, Chin said on the sidelines of an exhibition in Taipei.
The company has received several orders for electric vehicle (EV) charging piles this quarter from the public and private sectors, he said.
Photo courtesy of Leotek Corp
The company last year acquired UK-based industrial LED solutions provider Dialight PLC, which mainly operates in the US and Mexico.
The deal helped Leotek receive more US orders this year and achieve a penetration rate of up to 90 percent in the street lighting and traffic signaling equipment market in major US cities, including New York, San Francisco, Los Angeles, Dallas and Chicago, Chin said.
He did not provide an exact figure for the company’s projected revenue for this year, saying only that revenue in the first half was expected to outpace the second half at a 45 to 55 percent split, with the result depending on government bids and budgets, which vary from year to year.
Leotek operates plants in Taoyuan’s Longtan District (龍潭) and in San Jose, California, with each site accounting for 50 percent of the company’s total output, he said.
Most shipments to US customers are made through its US plant, while shipments to other countries are handled through its Taiwanese plant, he said.
Orders are likely to remain stable as local governments in Taiwan continue infrastructure renewal, while their counterparts in the US expand in smart transportation, EV charging and safety sensing, Chin said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome
RSS