Three local companies yesterday announced the formation of a joint venture to make inroads into the high-performance adhesive materials market for advanced chip packaging technology.
The three companies are semiconductor special chemicals supplier Advanced Echem Materials Co (新應材), Nan Pao Resins Chemical Co (南寶樹脂) and Trusval Technology Co Ltd (信紘科技), which specializes in developing water, chemical and special gas supplying systems for semiconductor plants.
The new venture, Advanced Pao Trusval Technology Co (新寶紘科技), is expected to help strengthen the localization of key semiconductor material supply and enhance material self-sufficiency, addressing the industry’s significant demand for high-quality adhesives, the companies said in a joint statement.
Photo: Reuters
Advanced adhesive materials play a critical role in determining chip manufacturers’ production yield and efficiency, and their importance is even greater in advanced packaging processes, the statement said.
Local chip companies have been reliant on overseas supply for such high-performance adhesive materials, it said.
The global semiconductor process tapes market is expected to expand at a compound annual growth rate of 9.7 percent during the next decade, benefiting from an artificial intelligence (AI) boom, which drives demand for AI chips and advanced packaging technology, the statement said.
Advanced Echem Materials would be the biggest stakeholder of the new venture with 36 percent, followed by Nan Pao Resins at 34 percent and Trusval Technology at 30 percent.
The new venture would have initial capital of NT$500 million (US$16.35 million), the statement said.
The move marks the second strategic investment by Advanced Echem Materials this year as the company increasingly focuses on crucial materials used in advanced chip packaging process technology.
In the first quarter, the company invested NT$200 million in e-Ray Optoelectronics Technology Co (昱鐳光電科技), which specializes in producing high-frequency adhesives used in advanced copper-clad laminates, it said.
Advanced Echem Materials is a supplier to Taiwan Semiconductor Manufacturing Co (台積電).
The company produces and develops critical materials for advanced processes such as surface modifiers, bottom anti-reflective coatings and edge bead removers.
It is also developing a range of front-end lithography materials, the company said.
Nan Pao said semiconductor and electronics adhesive materials contribute about 2 percent to the company’s revenue.
The company supplies ultraviolet debonding adhesives for semiconductor wafer dicing and packaging.
These adhesives are designed for advanced packaging processes such as laser cutting and thin-wafer separation, it said.
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