ASE Technology Holding Co (日月光), the world’s largest chip packaging and testing company, is partnering with artificial intelligence (AI) chip designer Advanced Micro Devices Inc (AMD) to improve the efficiency of data centers.
ASE has been using AMD’s Epyc and Ryzen processors in its data center systems, which are needed “to handle a big volume of data analysis,” an AMD blog cited ASE information technology infrastructure division director Jekyll Chen (陳裕忠) as saying.
The processors helped deliver “a simultaneous 50 percent improvement in performance and a 6.5 percent reduction in power consumption compared with the non-AMD systems it used previously,” the blog said.
Photo courtesy of ASE Technology Holding Co
Following the success of the Epyc and Ryzen processors, ASE has started looking into the possibility of introducing data center accelerators such as AMD’s Instinct MI300 Series graphics processing units (GPU), as AI workloads have become more important, the blog said.
For years, AMD has worked with contract chipmaker Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) in its development of next-generation GPUs.
AMD in April announced its next-generation Epyc processor, called “Venice,” which is the first high-performance computing processor on the market to use TSMC’s advanced 2-nanometer process.
AMD also highlighted the successful validation of its fifth-generation AMD Epyc central processing units at TSMC’s first wafer fab in Arizona, which began mass production last year using the 4-nanometer process.
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