Tokyo Electron Ltd, Asia’s biggest semiconductor equipment supplier, yesterday launched a NT$2 billion (US$61.5 million) operations center in Tainan as it aims to expand capacity and meet growing demand.
Its new Taiwan Operations Center is expected to help customers release their products faster, boost production efficiency and shorten equipment repair time in a cost-effective way, the company said.
The center is about a five-minute drive from the factories of its major customers such as Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) advanced 3-nanometer and 2-nanometer fabs.
Photo: Grace Hung, Taipei Times
The operations center would have about 1,000 employees when it is fully utilized, the company said.
TSMC vice president T.S. Chang (張宗生), who oversees advanced technology and mask engineering, attended the center’s opening ceremony, along with United Microelectronics Co (聯電) and Winbond Electronics Corp (華邦電) representatives.
“With the opening of this operations center, we aim to reach two goals: First, we aim to expand our scale to cope with the ongoing growth of the Taiwanese market. Second, we hope to shorten the product repairing time cycle and to broaden the supply chain,” Tokyo Electron Taiwan Ltd chairman Hikaru Ito said at the ceremony.
The six-floor facility is comprised of a repair center and a testing lab to provide customers with one-stop services, as Taiwan plays a key role in the global artificial intelligence (AI) industry, Tokyo Electron Taiwan president Roger Chang (張天豪) said.
For the first time, the company can help fix vacuum transpiration robotic arms used in semiconductor equipment for customers in Taiwan, it said.
In the past, it took about seven months to complete the whole repair process in Japan, compared with one to two months now, it said.
The new repair center would also help customers fix damaged ovens used in lithography equipment, it said.
The company is mulling to build a more resilient supply chain in Taiwan through sourcing key parts locally, it said, adding that it has a shortlist of potential suppliers.
Taiwan has become the fourth-biggest market for the company, accounting for 13.3 percent of its total revenue in the second quarter, a spike from 9.3 percent a year earlier, a company financial statement showed.
The new operations center demonstrates the close partnership between Taiwan and Japan in the semiconductor field, Minister of Economic Affairs J.W. Kuo (郭智輝) said at the opening ceremony.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass