Artificial intelligence (AI) chip designer Alchip Technologies Ltd (世芯) yesterday said that revenue would grow significantly again in 2026 after adding a major AI chip customer, reversing moderation amid a product transition next year.
The Taipei-based application-specific IC (ASIC) designer reiterated its strong revenue growth forecast for this year and 2026 after its stock plummeted about 23 percent to NT$3,145 from a peak of NT$4,085 on March 6 amid growing competition.
Alchip said it has built strong partnerships with cloud service providers (CSP), denying that it had lost orders to smaller competitors such as Faraday Technology Corp (智原).
Photo: screen grab from the Alchip Technologies Ltd Web site
Faraday said it has secured its first order to design AI chips for customers.
“We are working on several test chips for potential customers and I have high confidence that we will win those projects,” Alchip chief executive officer Johnny Shen (沈翔霖) told investors during an online conference yesterday. “As leading-edge process technologies, such as 5-nanometer, 4-nanometer and 3-nanometer, become more complicated, there is only a handful of companies capable of providing designing services.”
“Only Marvell Technology Inc, Broadcom Inc and Alchip have the capabilities and track record to provide such services,” Shen said. “The ASIC market is enormous and Alchip cannot do it all on its own. Competition is always welcomed.”
The ASIC market is expected to increase to US$70 billion in the next four years, compared with US$4 billion last year, Shen said, citing an unspecified forecast.
CSP companies are aiming to reduce chip supply from expensive suppliers, such as Nvidia Corp, and trying to develop their own AI chips, Shen said.
Alchip will be one of the biggest beneficiaries of this trend, he said.
Alchip said it expects its new contract with an integrated device manufacturer would be a significant revenue stream next year and in 2026.
The new customer would utilize 5-nanometer technology to produce its AI chip, Alchip said.
Intel Corp is widely believed to be the customer.
Alchip said it has secured several projects to design AI-related chips using 4-nanometer and 3-nanometer process technologies.
The company said it is highly confident that this year would be “another record-breaking year” in terms of revenue, which would expand significantly, in line with an estimate it made in its previous earnings call in March.
To facilitate AI chip production, Alchip said its top priority this year is to get as much advanced packaging chip-on-wafer-on-substrate capacity from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) as possible, Shen said.
“We have delivered a message to TSMC to get capacity support for a specific customer,” he said. “So far so good — we received reasonable feedback.”
Alchip reported that net profit soared 104 percent to US$38.99 billion last quarter, compared with US$19.12 billion a year earlier.
On a quarterly basis, net profit rose 10 percent from US$35.44 billion.
First-quarter revenue grew 77 percent year-on-year to US$333.57 million and 14.6 percent quarter-on-quarter.
More than 94 percent of its revenue came from 7-nanometer chips or more advanced chips, up from 83 percent in the same period last year and 92 percent the previous quarter.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome