Images in a graphic novel that were created using the artificial intelligence (AI) system Midjourney should not have been granted copyright protection, the US Copyright Office said in a letter seen by Reuters.
Zarya of the Dawn author Kris Kashtanova is entitled to a copyright for the parts of the book she wrote and arranged, but not for the images produced by Midjourney, the office said in a letter on Tuesday.
The decision is one of the first by a US court or agency on the scope of copyright protection for works created with AI, and comes amid the meteoric rise of generative AI software such as Midjourney, Dall-E and ChatGPT.
The letter said that the office would reissue its registration for Zarya of the Dawn to omit images that “are not the product of human authorship” and therefore cannot be copyrighted.
Kashtanova on Wednesday called it “great news” that the office allowed copyright protection for the novel’s story and the way the images were arranged, which she said “covers a lot of uses for the people in the AI art community.”
Kashtanova said she is considering how best to press ahead with the argument that the images themselves are a “direct expression of my creativity and therefore copyrightable.”
Midjourney general counsel Max Sills said the decision was “a great victory.”
Midjourney is an AI-based system that generates images based on text prompts entered by users. Kashtanova wrote the text of Zarya of the Dawn, and Midjourney created the book’s images based on prompts.
The Copyright Office told Kashtanova in October last year it was reconsidering the book’s copyright registration because the application did not disclose Midjourney’s role.
The office said on Tuesday that it would grant copyright protection for the book’s text and the way Kashtanova selected and arranged its elements.
However, it said Kashtanova was not the “master mind” behind the images themselves.
“The fact that Midjourney’s specific output cannot be predicted by users makes Midjourney different for copyright purposes than other tools used by artists,” the letter said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass