State-run utility Taiwan Power Co (Taipower, 台電) yesterday signed a memorandum of understanding (MOU) with Japan’s Mitsubishi Group to conduct a demonstration project that involves mixing ammonia with coal to generate power at the Linkou Power Plant (林口發電廠) in New Taipei City.
The project aims to achieve 5 percent cofiring of ammonia at the coal-fired plant by 2030 before increasing the use of ammonia to 20 percent, Taipower spokesman Wu Chin-chung (吳進忠) said.
If the 5 percent ammonia cofiring target is reached, it is expected to help the power plant reduce its carbon emissions by 9,000 tonnes per year, Taipower said.
Photo: Lin Jin-hua, Taipei Times
Emissions reduction in the power sector plays an important role in Taiwan’s efforts to reach its goal of net zero emissions by 2050.
Taipower continues to promote a coal-to-gas shift at coal-fired plants — which includes burning ammonia with coal — energy storage technologies and sources of renewable energy, Taipower president Wang Yao-ting (王耀庭) said during the signing ceremony.
Toshiyuki Hashi — chief executive officer of gas power at Mitsubishi Hitachi Power Systems Ltd, a power solutions brand — said that Taiwan and Japan face common challenges in fuel imports and development of renewable energy sources, adding that he believes through collaboration, the two countries can effectively foster and accelerate an energy transition.
Hiroki Haba, chief operating officer at Mitsubishi Corp’s Next Generation Fuels & Petroleum business division, said that the group plans to spend ￥1.2 trillion (US$8.6 billion) to develop next-generation energy technologies.
As part of that approach, Mitsubishi Corp is seeking to make the ammonia-coal cofiring technology used in the demonstration project with Taipower more cost competitive, Haba said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome
Semiconductor equipment billings in Taiwan are expected to double this year, as manufacturers in the industry are keen to expand production to meet strong global demand for artificial intelligence applications, according to SEMI, which represents companies in the electronics manufacturing and design supply chain. Speaking at a news conference before the opening of Semicon Taiwan trade show tomorrow, SEMI director of industry research and statistics Clark Tseng (曾瑞榆) said semiconductor equipment billings in Taiwan are expected to grow by an annual 100 percent this year, beating an earlier estimate of 70 percent growth. He said that Taiwan received a boost from a
RSS