CTBC Bank (中國信託商銀) was the only bank among the nation’s six “domestic systemically important banks” (D-SIB) that retained a capital adequacy gauge above the minimum requirements as of the end of June, data released last week by the Financial Supervisory Commission showed.
Five other D-SIBs failed to meet the requirements of 11 percent for a common equity tier-1 ratio, 12.5 percent for a tier-1 capital ratio and 14.5 percent for capital adequacy ratio, as set by the regulator due to the effects of volatile financial markets, the commission said.
CTBC’s common equity tier-1 ratio, tier-1 capital ratio and capital adequacy ratio stood at 11.7 percent, 13.29 percent and 15.15 percent respectively at the end of June, commission data showed.
Photo courtesy of CTBC Bank Co
These gauges provide regulators and investors with the information required to estimate whether a bank can withstand financial stress. To meet higher requirements, a bank usually boosts its core capital or reduces its loans.
The other five banks are Taipei Fubon Commercial Bank (台北富邦銀行), Cathay United Bank (國泰世華銀行), Mega International Commercial Bank (兆豐銀行), Taiwan Cooperative Bank (合庫銀行) and First Commercial Bank (第一銀行).
The commission said the five banks saw some or all of their capital gauges fall below the minimum requirements because of higher risk-weighted assets such as mortgages, or due to falling core capital like shareholders’ equity or retained earnings, it said, adding that banks should promptly improve their capital standards.
Banks in Taiwan reported an average common equity tier-1 ratio of 10.8 percent, tier-1 capital ratio of 12.03 percent and capital adequacy ratio of 14.22 percent at the end of June.
The domestic unit of the Chinese-owned, Dutch-headquartered chipmaker Nexperia BV will soon be able to produce semiconductors locally within China, according to two company sources. Nexperia is at the center of a global tug-of-war over critical semiconductor technology, with a Dutch court in February ordering a probe into alleged mismanagement at the company. The geopolitical tussle has disrupted supply chains, with some carmakers reportedly forced to cut production due to chip shortages. Local production would allow Nexperia’s domestic arm, Nexperia Semiconductors (China) Ltd (安世半導體中國), to bypass restrictions in place since October on the supply of silicon wafers — etched with tiny components to
Singapore-based ride-hailing and delivery giant Grab Holdings Ltd has applied for regulatory approval to acquire the Taiwan operations of Germany-based Delivery Hero SE's Foodpanda in a deal valued at about US$600 million. Grab submitted the filing to the Fair Trade Commission on Friday last week, with the transaction subject to regulatory review and approval, the company said in a statement yesterday. Its independent governance structure would help foster a healthy and competitive market in Taiwan if the deal is approved, Grab said. Grab, which is listed on the NASDAQ, said in the filing that US-based Uber Technologies Inc holds about 13 percent of
Taiwan is open to joining a global liquefied natural gas (LNG) program if one is created, but on the condition that countries provide delivery even in a scenario where there is a conflict with China, an energy department official said yesterday. While Taiwan’s priority is to have enough LNG at home, the nation is open to exploring potential strategic reserves in other countries such as Japan or South Korea, Energy Administration Deputy Director-General Chen Chung-hsien (陳崇憲) said. While the LNG market does not have a global reserve for emergencies like that of oil, the concept has been raised a few times —
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday received government approval to deploy its advanced 3-nanometer (3nm) process at its second fab currently under construction in Japan, the Ministry of Economic Affairs said in a news release. The ministry green-lit the plan for the facility in Kumamoto, which is scheduled to start installing equipment and come online in 2028 with a monthly production capacity of 15,000 12-inch wafers, the ministry said. The Department of Investment Review in June 2024 authorized a US$5.26 billion investment for the facility, slated to manufacture 6- to 12nm chips, significantly less advanced than 3nm process. At a meeting with