The Financial Supervisory Commission (FSC) is considering easing punishments for companies that fail to hold shareholders’ meeting by the end of June due to the COVID-19 outbreak, as health authorities suggest that people cancel or avoid public gatherings of more than 1,000 people, FSC Chairman Wellington Koo (顧立雄) told a meeting of the legislature’s Finance Committee yesterday.
Publicly listed companies must hold their annual general meetings by the end of June or face a fine of NT$240,000 to NT$4.8 million (US$7,990 to US$159,798), according to the Securities and Exchange Act (證交法).
The commission would also encourage companies to use an electronic voting system operated by Taiwan Depository and Clearing Corp (TDCC, 台灣集中保管結算所) to reduce the possibility of infection, Koo said.
Listed companies with paid-in capital of more than NT$10 billion and more than 10,000 shareholders have been asked to offer the e-voting tool, dubbed “Stockvote,” to their shareholders, the commission said.
Last year, shareholders who used the system accounted for 52.54 percent of the total, TDCC data showed.
“Big companies might find themselves in an awkward situation if they have more than 1,000 shareholders to attend the meetings,” Democratic Progressive Party (DPP) Legislator Sheng Fa-hui (沈發惠) said at the meeting.
Hon Hai Precision Industry Co (鴻海精密), the biggest assembler of Apple Inc’s iPhones, for example, drew more than 3,000 people to its shareholders’ meeting last year, about 1,000 more than the number of attendees in the previous two years, Sheng said.
While most listed companies are to convene their shareholders’ meetings in June, some that usually have the meetings in April or May might decide to postpone them to June because of the virus fears, he said.
Shareholders who have respiratory symptoms or a fever should be allowed to attend the meetings to exercise their rights, but companies need to take extra measures to prevent infection, Koo said.
The commission is expected to make public its relaxed rules later next month at the earliest, he said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass