Renesas Electronics Corp, the Japanese chipmaker getting a bailout from a state-backed fund, may replace president Yasushi Akao this month, a company official said.
The company may name Renesas senior vice president Tetsuya Tsurumaru to succeed Akao, said the official, who declined to be identified because the information is not yet public. Tsurumaru, 58, started at Hitachi Ltd in 1979 and spent most of his career in production after joining Renesas’s predecessor company in 2003, according to the manufacturer’s Web site.
The new president would take over in the midst of a restructuring effort that includes more than 10,500 job cuts announced since July as Renesas tries to recover from losses amid falling demand for its system LSI chips. The company plans to sell ¥150 billion (US$1.6 billion) of new shares to investors led by state-backed Innovation Network Corp of Japan as part of a bailout.
The Nikkei Shimbun said earlier yesterday that Tsurumaru would be named president. Renesas was not the source of the report, and no decision has been made, the Kawasaki-based company said in a statement to the Tokyo Stock Exchange.
Renesas, which supplies Apple Inc and Nintendo Co, widened its full-year net loss forecast to ¥176 billion on Feb. 8 because of lower-than-expected orders in the fourth quarter and charges to write down its assets.
The domestic unit of the Chinese-owned, Dutch-headquartered chipmaker Nexperia BV will soon be able to produce semiconductors locally within China, according to two company sources. Nexperia is at the center of a global tug-of-war over critical semiconductor technology, with a Dutch court in February ordering a probe into alleged mismanagement at the company. The geopolitical tussle has disrupted supply chains, with some carmakers reportedly forced to cut production due to chip shortages. Local production would allow Nexperia’s domestic arm, Nexperia Semiconductors (China) Ltd (安世半導體中國), to bypass restrictions in place since October on the supply of silicon wafers — etched with tiny components to
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Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday received government approval to deploy its advanced 3-nanometer (3nm) process at its second fab currently under construction in Japan, the Ministry of Economic Affairs said in a news release. The ministry green-lit the plan for the facility in Kumamoto, which is scheduled to start installing equipment and come online in 2028 with a monthly production capacity of 15,000 12-inch wafers, the ministry said. The Department of Investment Review in June 2024 authorized a US$5.26 billion investment for the facility, slated to manufacture 6- to 12nm chips, significantly less advanced than 3nm process. At a meeting with