Share prices for Insyde Software Corp (系微), a leading PC BIOS (basic input/output system) program provider, rose 6.33 percent yesterday on market speculation that Intel Corp would purchase some of its unsecured convertible bonds to become a strategic investor.
The board of the Taipei-based company last week approved a plan to issue as much as NT$300 million (US$10.07 million) in 3.5-year unsecured convertible bonds at a coupon rate of less than 1 percent, according to a stock exchange filing issued on Friday.
Insyde Software said in the filing it would use the bond issuing to secure strategic investors and use the proceeds to strengthen its working capital, as well as develop new products and technologies.
The company’s board did not set the conversion price for the bonds last week or identify potential investors. Instead, in a separate filing, Insyde Software said it was scheduled to hold an extraordinary shareholders meeting on Nov. 10 to set the price and release other details.
Insyde Software shares rose NT$7.5 to close at NT$126 on the Taiwan Stock Exchange yesterday. The Chinese-language United Evening News reported yesterday that Intel could own a 8.24 percent stake in Insyde Software if the global chip giant exchanged the convertible bonds for the Taiwanese company’s shares, without saying where it got the information.
The domestic unit of the Chinese-owned, Dutch-headquartered chipmaker Nexperia BV will soon be able to produce semiconductors locally within China, according to two company sources. Nexperia is at the center of a global tug-of-war over critical semiconductor technology, with a Dutch court in February ordering a probe into alleged mismanagement at the company. The geopolitical tussle has disrupted supply chains, with some carmakers reportedly forced to cut production due to chip shortages. Local production would allow Nexperia’s domestic arm, Nexperia Semiconductors (China) Ltd (安世半導體中國), to bypass restrictions in place since October on the supply of silicon wafers — etched with tiny components to
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Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday received government approval to deploy its advanced 3-nanometer (3nm) process at its second fab currently under construction in Japan, the Ministry of Economic Affairs said in a news release. The ministry green-lit the plan for the facility in Kumamoto, which is scheduled to start installing equipment and come online in 2028 with a monthly production capacity of 15,000 12-inch wafers, the ministry said. The Department of Investment Review in June 2024 authorized a US$5.26 billion investment for the facility, slated to manufacture 6- to 12nm chips, significantly less advanced than 3nm process. At a meeting with