Samsung Electronics Co plans to build a US$670 million plant to make mobile phone handsets in northern Vietnam, a Vietnamese official said yesterday.
The world's second largest handset maker has been pushing for the Vietnam plant for nearly a year and submitted the proposal to authorities in Bac Ninh Province earlier last month, said Nguyen Quang Thanh of the provincial planning and investment department.
"They still lack some papers," Thanh said. "Once they fill in all necessary papers, we will grant the investment license right away."
RAMPING UP
The plant will produce 30 million mobile phone handsets a year in the first stage and will gradually expand to produce 100 million units, he said. Bac Ninh is 30km northeast of Hanoi.
Samsung executives in Hanoi were not available for comment yesterday. But officials from the South Korean company had earlier said that they were considering Vietnam for its cheap labor.
In addition to Samsung's domestic handset plant at Gumi, some 260km southeast of Seoul, Samsung also has handset facilities in China, India and Brazil.
DRAWING INVESTORS
Vietnam is the 6th most attractive place for foreign investors behind China, India, Russia, the US and Brazil, said Phan Huu Thang, director of the Foreign Investment Department, quoting the 2007 World Investment Report from the UN Conference on Trade and Development.
Pledges for foreign investment in Vietnam surged nearly 70 percent last year to a record US$20.3 billion.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would