TaiMed Biologics Inc’s (中裕新藥) sales of its Trogarzo HIV treatment are forecast to boom this year after the European Commission on Thursday last week approved it to be marketed, the company said yesterday.
The company plans to begin marketing the drug in Germany this year, as the nation has friendly regulations on drug pricing, allowing companies to market products before wholesale prices are finalized, TaiMed chief financial officer Jack Chen (陳怡成) said by telephone.
Company partner Montreal-based Theratechnologies Inc has begun making connections with hospitals and patients in Germany, targeting sales of the drug by the end of this year or at the beginning of next year, Chen said.
Theratechnologies — TaiMed’s exclusive marketing and distribution partner in more than 30 markets, including the US, Canada and the EU — is to negotiate prices with regulatory bodies in Europe, he said.
The European price has been estimated at 30 percent lower than US$118,000 for a year of treatment in the US, he said.
Trogarzo is a fourth-line treatment and a drug that is designed for people with multi-drug resistance, TaiMed said.
The number of people in Europe with HIV/AIDS who are multi-drug resistant, which means they require alternative treatments, is estimated to be between 20,000 and 25,000, Chen said.
TaiMed is to pay US$5 million to US-based Genentech Inc as a milestone payment, as Genentech developed and licensed the antibody ibalizumab (TMB-355), a key ingredient of Trogarzo.
TaiMed posted revenue of NT$283 million (US$9.12 million) in the first half of this year and expects its full-year revenue to reach NT$800 million thanks to stable sales of Trogarzo in the US, Chen said, adding that the company started marketing the drug in the US in April last year.
It reported a non-operating loss of NT$43 million in the first half, due to a drop in the value of its stake in Theratechnologies, Chen said.
Gross margin fell to 17 percent for the first six months due to low production yield at contract manufacturer WuXi Biologics Co (無錫生物製藥), which is responsible for the production of Trogarzo, Chen said, adding that the yield improved in the third quarter.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome