STOCK MARKET
TWSE approves chairman
The the Taiwan Stock Exchange’s (TWSE) board of directors on Friday approved the appointment of former minister without portfolio Hsu Chang-yao (許璋瑤) as its chairman. The 66-year-old Hsu from 2004 to 2008 served as head of the Directorate-General of Budget, Accounting and Statistics, and was named minister without portfolio in charge of accounting, statistics and financial affairs in May last year. The government had been looking for a new chairman for the exchange since former chairman Shih Jun-ji (施俊吉) became vice premier in September.
ENERGY
New CPC chair appointed
The Ministry of Economic Affairs on Friday appointed Southern Taiwan University of Science and Technology principal Tai Chein (戴謙) to lead CPC Corp, Taiwan (CPC, 台灣中油). The state-run oil refiner is scheduled to convene a board meeting today to officially elect Tai as chairman, the ministry said. Tai was formerly vice minister of the National Science Council before he became principal of the university in August 2007. The ministry said Tai’s appointment reflects his expertise in science and his management capabilities.
AVIATION
CAL partners with Airbus
Airbus SE has chosen China Airlines Ltd (CAL, 中華航空) to become one of its maintenance, repair and overhaul suppliers in Asia, a press release said on Thursday. CAL senior vice president Houng Wang (王宏) said the company will also provide aircraft conversion services for the European firm. After opening a new hangar next year, Wang said the company is confident that its growing capabilities will offer comprehensive solutions to support Airbus aircraft in Taiwan.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
RSS