Taiwanese and US participants, including Microsoft Corp representatives, at a forum in Taoyuan on Tuesday explored a road map for the government’s “Asian Silicon Valley Development Plan.”
The forum was the first event since the National Development Council and the American Institute in Taiwan in April launched the Digital Economy Forum Smart Technology Working Group, a public-private partnership that aims to push cooperation in “smart” technology.
The working group aims to revamp Taiwan’s hardware export-focused technology sector by improving collaboration with Silicon Valley in California, as well as implementing emerging trends such as automaton and industry 4.0 systems, in the hopes that local enterprises might be able to offer tailor-made solutions for global markets.
Microsoft presented an Internet of Things innovation center it has established in Taiwan — the first of its kind in the world — and showcased its artificial intelligence solution, as well as new applications for HoloLens, the US technology giant’s mixed-reality technology.
Experts said that the use of smart technologies in cities would allow governments to combat pressing concerns such as traffic congestion, pollution, climate change and crime.
Taoyuan is the ideal location to spearhead the Asian Silicon Valley initiative, as 200 of the nation’s 500 largest manufacturers are based in the special municipality, Taoyuan Deputy Mayor Wang Ming-teh (王明德) said at the forum.
Taoyuan has been transforming into a hub for smart technology, as well as electric vehicles and “green” energy, Wang said, adding that its connection to Taipei via the Taoyuan International Airport MRT Line makes it an ideal hub for the initiative.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
Germany is to establish its first-ever national pavilion at Semicon Taiwan, which starts tomorrow in Taipei, as the country looks to raise its profile and deepen semiconductor ties with Taiwan as global chip demand accelerates. Martin Mayer, a semiconductor investment expert at Germany Trade & Invest (GTAI), Germany’s international economic promotion agency, said before leaving for Taiwan that the nation is a crucial partner in developing Germany’s semiconductor ecosystem. Germany’s debut at the international semiconductor exhibition in Taipei aims to “show presence” and signal its commitment to semiconductors, while building trust with Taiwanese companies, government and industry associations, he said. “The best outcome
Semiconductor equipment billings in Taiwan are expected to double this year, as manufacturers in the industry are keen to expand production to meet strong global demand for artificial intelligence applications, according to SEMI, which represents companies in the electronics manufacturing and design supply chain. Speaking at a news conference before the opening of Semicon Taiwan trade show tomorrow, SEMI director of industry research and statistics Clark Tseng (曾瑞榆) said semiconductor equipment billings in Taiwan are expected to grow by an annual 100 percent this year, beating an earlier estimate of 70 percent growth. He said that Taiwan received a boost from a
RSS