Japan’s economic recovery gained momentum last month as manufacturing accelerated and consumer prices rose for a second straight month, despite weaker household spending and retail sales.
The data released yesterday showed the consumer price index (CPI) rose 0.7 percent last month from a year earlier, for the second straight month of gains. That suggests efforts to break free of years of demand-dampening deflation are progressing. The CPI rose 0.2 percent in June.
However, the core index, which excludes food and energy prices, fell 0.1 percent.
The Ministry of Economy, Trade and Industry said industrial output rose 1.6 percent from a year earlier and 3.2 percent from the month before, in a sign the recovery is taking hold. It forecasts further expansion this month and next month.
“Income and other data show quite positive signs of recovery,” RBS Japan Securities economist Junko Nishioka said.
The government has boosted spending and pushed for ultra-loose monetary policies aimed at generating inflation. It says that will help perk up demand and, in response, investment and employment, ending years of stagnation.
However, economists say that without matching increases in wages, rising prices and planned tax hikes could actually weaken the consumer demand that accounts for the bulk of business activity, undermining any economic rebound.
Average household spending fell 1.4 percent last month from a year earlier, despite slight improvements in income and the jobless rate, which fell to 3.8 percent from 3.9 percent the month before.
Retail sales fell 0.3 percent last month from a year earlier for the first decline in three months. Sales of clothing and other items sagged, while food sales rose.
The government attributed at least some of the limpness of demand to hot weather.
However, with prices rising, many consumers already are feeling a pinch, Capital Economics said in a commentary.
“Perhaps the biggest threat to consumer spending is the rise in inflation,” it said, adding that bustling sales earlier in the summer were probably helped by bonus payments and overtime in June.
“Households are probably well aware that once the summer bonus season is over, wages will likely continue shrinking, depressing their purchasing power,” it said.
Still, the overall positive tone of last month’s data will likely bolster support for pushing ahead with a sales tax planned for April 1 next year. A decision on that plan is due within the next month.
The anticipated 3 percentage point increase in the nationwide sales tax to 8 percent will undoubtedly be a blow, Ishioka said, but she expects it to be short-lived given the currently favorable trends.
“People’s sentiment is improving. I think the fundamental conditions are OK,” she said.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) secured a record 70.2 percent share of the global foundry business in the second quarter, up from 67.6 percent the previous quarter, and continued widening its lead over second-placed Samsung Electronics Co, TrendForce Corp (集邦科技) said on Monday. TSMC posted US$30.24 billion in sales in the April-to-June period, up 18.5 percent from the previous quarter, driven by major smartphone customers entering their ramp-up cycle and robust demand for artificial intelligence chips, laptops and PCs, which boosted wafer shipments and average selling prices, TrendForce said in a report. Samsung’s sales also grew in the second quarter, up
LIMITED IMPACT: Investor confidence was likely sustained by its relatively small exposure to the Chinese market, as only less advanced chips are made in Nanjing Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) saw its stock price close steady yesterday in a sign that the loss of the validated end user (VEU) status for its Nanjing, China, fab should have a mild impact on the world’s biggest contract chipmaker financially and technologically. Media reports about the waiver loss sent TSMC down 1.29 percent during the early trading session yesterday, but the stock soon regained strength and ended at NT$1,160, unchanged from Tuesday. Investors’ confidence in TSMC was likely built on its relatively small exposure to the Chinese market, as Chinese customers contributed about 9 percent to TSMC’s revenue last
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17