Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), the world’s largest contract chipmaker, said it expects its 2-nanometer (2nm) chip capacity to grow at a compound annual rate of 70 percent from this year to 2028.
The projection comes as five fabs begin volume production of 2-nanometer chips this year — two in Hsinchu and three in Kaohsiung — TSMC senior vice president and deputy cochief operating officer Cliff Hou (侯永清) said at the company’s annual technology symposium in Silicon Valley, California, last week.
Output in the first year of 2-nanometer production, which began in the fourth quarter of last year, is expected to be 45 percent higher than that of 3-nanometer chips in their first year in 2023, Hou said.
Photo: Ritchie B. Tongo, EPA
TSMC would also continue expanding its 3-nanometer chip capacity, with annual growth of about 25 percent expected between 2022 and next year, he added.
The company said it is also ramping up advanced packaging capacity.
Chip-on-wafer-on-substrate capacity is expected to grow by more than 80 percent annually from 2022 to next year, while system on integrated chips capacity is projected to increase by more than 90 percent per year.
Overseas, TSMC’s first fab in Arizona is expected to raise output by 80 percent this year compared with last year, while its first fab in Kumamoto, Japan, is projected to increase output by 130 percent year-on-year, Hou said.
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