Contract chipmaker United Microelectronics Corp (UMC, 聯電) yesterday said it has signed a memorandum of understanding (MOU) with Polar Semiconductor LLC to collaborate on the production of 8-inch wafers in the US.
The collaboration aims to strengthen 8-inch wafer manufacturing in the US amid Washington’s efforts to increase onshore manufacturing of semiconductors, contribute to supply chain resilience against shifting geopolitical dynamics, and ensure a secure domestic supply of power semiconductors critical to automotive, electric grids, robotic manufacturing and data centers, the companies said in a joint statement.
Under the MOU, Polar and UMC will identify devices for Polar to manufacture at its recently expanded 8-inch facility in Minnesota, the statement said. By combining Polar’s proven manufacturing capabilities with UMC’s comprehensive 8-inch technology portfolio and global customer base, this partnership is set to drive growth for both companies while supporting customers’ multi-sourcing strategies, it said.
Photo: Grace Hung, Taipei Times
“This partnership directly addresses our customers’ needs for more made-in-USA chips, reflecting UMC’s dedication to delivering value through innovative solutions and mutually beneficial partnerships,” UMC senior vice president for global sales Oliver Chang (張士昌) said in the statement.
UMC has no chip manufacturing operations in the US. The company is collaborating with Intel Corp to jointly develop 12-nanometer process technology and aims to ramp up production of 12-nanometer chips at an Intel plant in 2027.
UMC has diversified its manufacturing footprints beyond Taiwan and China in recent years to meet customers’ demand amid rising geopolitical risks. In Singapore, the company plans to ramp up production of 22-nanometer and 28-nanometer chips at a new plant early next year.
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