Two Indian officials are visiting Taiwan to attend Semicon Taiwan trade show and meet with local industry leaders to enhance collaboration between India and Taiwan in the global semiconductor ecosystem.
“Taiwan has built a place for itself in this entire value chain. So clearly, there is something that Taiwan has done right over the years,” S. Krishnan, secretary of Indian Ministry of Electronics and Information Technology, said at a press event in Taipei.
Over the past decades, Taiwanese companies such as Hon Hai Precision Industry Co (鴻海精密), also known internationally as Foxconn Technology Group (富士康科技集團), Pegatron Corp (和碩) and Delta Electronics Inc (台達電) have been successful in India, particularly in the electronics sector, he noted.
Photo courtesy of the India Taipei Association via CNA
Last year, India’s Tata Electronics Pvt Ltd partnered with Taiwan’s Powerchip Semiconductor Manufacturing Corp (力積電) to establish India’s first 12-inch wafer fabrication plant, in Dholera, Gujarat, Krishnan said.
Such cooperation between India and Taiwan indicates that India is “favorable ground” for the high tech industry, as it is “a big market, a source of human resources, and a source of a youthful population with talent,” he said.
The other Indian official visiting Taiwan this week is Amitesh Sinha, CEO of India Semiconductor Mission, the government agency responsible for formulating and implementing strategic initiatives in the field of semiconductors.
The two Indian officials are aiming to explore new synergies in areas such as advanced semiconductor design and manufacturing, capital equipment, and supply chain resilience, according to the India Taipei Association, which represents India’s interests in Taiwan in the absence of diplomatic ties.
Asked about his impressions so far, Krishnan said he has learned that Taiwan hosts a number of niche technologies in the semiconductor sector, which provide different kinds of services.
“We [in India] need to look at the entire ecosystem in order to support a number of linked companies,” he said.
The secretary also said he was impressed with how Taiwan’s “academic institutions are aligned with what is being done for the semiconductor sector.”
“So, we have to aim for a much closer alignment between our leading academic institutions and what is happening in the semiconductor space,” he added.
Semicon Taiwan is an annual trade exhibition and conference for semiconductor, semiconductor device fabrication, microelectronics manufacturing, packaging, and test technologies.
The three-day event, which concludes today, features more than 1,200 semiconductor and technology companies, with over 4,100 booths, and it is expected to draw an estimated 100,000 industry professionals, according to the organizers.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
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