Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is expected to lead its peers in the advanced 2-nanometer process technology, despite competition from Samsung Electronics Co and Intel Corp, TrendForce Corp analyst Joanne Chiao (喬安) said.
TSMC’s sophisticated products and its large production scale are expected to allow the company to continue dominating the global 2-nanometer process market this year, Chiao said.
The world’s largest contract chipmaker is scheduled to begin mass production of chips made on the 2-nanometer process in its Hsinchu fab in the second half of this year. It would also hold a ceremony on Monday next week to mark its efforts to expand 2-nanometer production in its Kaohsiung plant.
                    Photo: Ann Wang, Reuters
TSMC, which has grasped almost all global businesses in chips used in artificial intelligence applications by using its 3-nanometer process technology, expects its 2-nanometer process to attract even more orders, as more clients have expressed interest in using the new technology.
Samsung so far has not built a large customer base for its 2-nanometer process yet, and its major user is expected to come from its system LSI units, Chiao said.
Therefore, the top priority for the South Korean chipmaker is to improve yield rates and customer services to gain a larger share of the 2-nanometer market, she said.
A recent report from South Korea’s The Bell said that Samsung has introduced a gate-all-around architecture, which reduces undesirable variability and mobility loss, to the 2-nanometer process, as TSMC has done, but TSMC’s yield rates are more than double Samsung’s.
Meanwhile, Intel lags behind TSMC in the number of production methods, making it less flexible in meeting its clients’ demands, Chiao said.
However, Intel’s cooperation with United Microelectronics Corp (聯電) is expected to help it generate more sales in the foundry business, she added.
Even though investors might be concerned about TSMC’s expansion in the US amid geopolitical tensions, the company is expected to keep its top spot in the market, financial Web site Seeking Alpha reported on Saturday, citing Citigroup Inc analyst Laura Chen (陳佳儀).
“We believe TSMC’s near-term outlook and long-term prospects are on track, and don’t expect any potential [joint venture] to change the advanced semiconductor industry landscape,” Chen wrote in a note to clients, referencing a potential joint venture for Intel’s operations.
With TSMC announcing a new US$100 billion investment in the US over the next four years earlier this month, the company could increase capacity by as much as 20 percent or more in the advanced node part of the foundry market by 2030, Seeking Alpha reported, citing Chen.
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would