The automotive and industrial Internet of Things are two major growth drivers for NXP Semiconductors NV in the next three years, despite the US’ tightening curbs on semiconductor exports to China, the world’s second-largest car chip supplier said yesterday.
The company expects the two segments to see business grow at between 8 and 12 percent from next year to 2027, NXP executive vice president and chief sales officer Ron Martino said at a media briefing in Taipei.
Martino attributed the growth mainly to an increase in semiconductor contents in cars, though the electric vehicle (EV) market is slowing and uncertainty about the world economy abounds, he said.
Photo on courtesy of NXP Semiconductors NV
Asked about what the US’ latest semiconductor export restrictions to China imply for the Dutch company, Martino said that NXP provides services in many countries and regions around the world, and it works to comply with all regulatory requirements placed on the company.
“We have been managing this for many years, very effectively, and we will continue to manage it as different regulatory requirements are applied to NXP,” Martino said.
“We continue to see a very healthy business. We continue to see that we work well together across all regions, with all parties,” he added.
China was the biggest market for NXP last year, representing 33 percent of the company’s total revenue.
The Asia-Pacific market, excluding China, came second with a 28 percent share.
In Taiwan, NXP has formed strong partnerships with Hon Hai Precision Industry Co (鴻海精密) and Foxtron Vehicles Technologies Co (鴻華先進) to introduce at least four EV models in a very short period of time, Martino said.
That is because NXP can bring its new technologies to the market faster in about one to two years, compared with a longer cycle of three to five years, he said.
Aside from Taiwan, such short development cycles only occur in some innovative and disruptive companies in the US or China, he said.
In related news, Hon Hai yesterday reported revenue last month grew 3.47 percent from a year earlier to NT$672.59 billion (US$20.73 billion), benefiting from strong demand for artificial intelligence servers and related components as well as new notebook computers.
“The second half of the year is traditionally the peak season for the information and communication technology industry, so operations are expected to gradually gain momentum quarter by quarter,” Hon Hai said in a statement.
Revenue this quarter is expected to “show significant growth on both a quarterly and yearly basis,” it said.
In the first 11 months, the company accumulated NT$6.21 trillion in revenue, an increase of 8.87 percent from NT$5.7 trillion in the same period last year, Hon Hai said.
Hon Hai, a major assembler of iPhones and AI servers powered by Nvidia Corp's chips, expected revenue this year to grow "significantly" from last year to reach an all-time high.
Shares of contract chipmaker Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) came under pressure yesterday after a report that Apple Inc is looking to shift some orders from the Taiwanese company to Intel Corp. TSMC shares fell NT$55, or 2.4 percent, to close at NT$2,235 on the local main board, Taiwan Stock Exchange data showed. Despite the losses, TSMC is expected to continue to benefit from sound fundamentals, as it maintains a lead over its peers in high-end process development, analysts said. “The selling was a knee-jerk reaction to an Intel-Apple report over the weekend,” Mega International Investment Services Corp (兆豐國際投顧) analyst Alex Huang
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is expected to remain Apple Inc’s primary chip manufacturing partner despite reports that Apple could shift some orders to Intel Corp, industry experts said yesterday. The comments came after The Wall Street Journal reported on Friday that Apple and Intel had reached a preliminary agreement following more than a year of negotiations for Intel to manufacture some chips for Apple devices. Taiwan Institute of Economic Research (台灣經濟研究院) economist Arisa Liu (劉佩真) said TSMC’s advanced packaging technologies, including integrated fan-out and chip-on-wafer-on-substrate, remain critical to the performance of Apple’s A-series and M-series chips. She said Intel and Samsung
POWER BUILDUP: Powered by Nvidia’s B200 Blackwell chips, the data center would support MediaTek’s computing power demand and business growth, the company said Smartphone chip designer MediaTek Inc (聯發科) yesterday launched a new artificial intelligence (AI) data center with a maximum capacity of 45 megawatts to meet its rising demand for computing power required to develop new advanced chips for AI applications. The company has completed the first-phase computing power buildup at the data center in Miaoli County’s Tongluo Township (銅鑼), providing 15 megawatts of capacity to support its research and development (R&D) capabilities, despite an industrywide shortage of key components, MediaTek said. Supply constraints have plagued a wide range of key components, including memory chips, solid-state drives, power supply units and central
TRANSITION: With the closure, the company would reorganize its Taiwanese unit to a sales and service-focused model, Bridgestone said Bridgestone Corp yesterday announced it would cease manufacturing operations at its tire plant in Hsinchu County’s Hukou Township (湖口), affecting more than 500 workers. Bridgestone Taiwan Co (台灣普利司通) said in a statement that the decision was based on the Tokyo-based tire maker’s adjustments to its global operational strategy and long-term market development considerations. The Taiwanese unit would be reorganized as part of the closure, effective yesterday, and all related production activities would be concluded, the statement said. Under the plan, Bridgestone would continue to deepen its presence in the Taiwanese market, while transitioning to a sales and service-focused business model, it added. The Hsinchu