Samsung Electronics Co has postponed taking deliveries of ASML Holding NV chipmaking equipment for its upcoming factory in Texas as it has yet to win any major customers for the project, three people familiar with the matter said.
Samsung has been also holding off on placing orders to some other suppliers for the US$17 billion factory in Taylor, prompting them to look for other customers and send staff deployed on site back home, three other people familiar with the matter said.
The delay in equipment deliveries is a fresh setback to the Taylor project, which is at the heart of Samsung chairman Jay Y. Lee’s ambition to expand beyond its bread-and-butter memory chips into contract chip manufacturing, which Taiwan Semiconductor Manufacturing Co (台積電) dominates.
Photo: AFP
ASML, the world’s biggest chipmaking equipment supplier, on Tuesday cut its sales forecast for this year, citing weakness in markets other than artificial intelligence and delayed fabs.
The Dutch company did not name clients who have delayed their fabs. Reuters is the first to report that Samsung has pushed back deliveries of some ASML equipment.
Two of the sources said the delayed shipments to Samsung’s Taylor factory involve ASML’s advanced chipmaking equipment called extreme ultraviolet (EUV) lithography.
One of them said the deliveries were scheduled earlier this year, but the machines have not been shipped yet. The third source said Samsung has pushed back delivery of some ASML equipment to the factory, without elaborating on the equipment or the revised delivery schedule.
EUV machines, which cost about US$200 million each, create design features on silicon wafers by using beams of light, and are widely used to manufacture advanced chips found in smartphones, electronic devices and AI servers.
Samsung in April said that production at the Taylor plant would begin in 2026 instead of this year.
Lee told Reuters earlier this month that the company was facing challenges on the factory.
Sources and analysts said there was a risk of further delays.
“Without new volume clients, even the 2026 timetable looks challenging... We see a possibility of a further delay and an asset write-off,” Macquarie analysts said in a report last month, adding that the fab could be “a stranded asset.”
BNK Investment & Securities analyst Lee Min-hee said that if Samsung does not place orders for other equipment by early next year, it could signal further delays, given the lead time required to start production.
The South Korean firm aims to complete construction of the building by early next year, a person familiar with the matter said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass