Apple Inc on Saturday said that recent claims of new iPhones getting too hot to the touch are due to software and app-related bugs, and that fixes are coming soon.
The company said the device can get warm in the first few days as it works overtime to get set up and restore a user’s data, due to a bug in the latest iOS 17 software, and because of some third-party apps overloading the system.
Apple told Bloomberg it is working with developers behind the apps causing the iPhone to overheat and that fixes are in the process of being released. A spokesman said that Instagram from Meta Platforms Inc, Uber Technologies Inc’s app and the game Asphalt 9: Legends have caused the device to run warmer than normal. Instagram already mitigated the problem with its app on Wednesday, Apple said.
Photo: Reuters
The latest high-end device includes a titanium frame, a first for the iPhone, as well as an A17 Pro chip with an enhanced graphics component for improved gaming. Some researchers said those hardware changes could have contributed to the issue.
Yet Apple denied that the problem is related to the hardware of the iPhone 15 Pro line, saying that the new design results in improved heat dissipation compared with prior stainless steel devices. It also said that the upcoming software fix will not involve slowing down the processor of the latest models.
Apple also said the issue is not a safety problem and would not impact the performance of the iPhone. It added that USB-C charging, the new standard included with the latest models, is not a cause of the overheating. It did, however, say that the use of a large charging adapter — those that offer more than 20 watts — could cause iPhones to temporarily feel hotter than usual.
Apple did not say when the iOS 17 software update would be available or which version it would carry. The company last week released the first beta version of iOS 17.1 to app developers. That release is scheduled for later this month.
Shares of contract chipmaker Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) came under pressure yesterday after a report that Apple Inc is looking to shift some orders from the Taiwanese company to Intel Corp. TSMC shares fell NT$55, or 2.4 percent, to close at NT$2,235 on the local main board, Taiwan Stock Exchange data showed. Despite the losses, TSMC is expected to continue to benefit from sound fundamentals, as it maintains a lead over its peers in high-end process development, analysts said. “The selling was a knee-jerk reaction to an Intel-Apple report over the weekend,” Mega International Investment Services Corp (兆豐國際投顧) analyst Alex Huang
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is expected to remain Apple Inc’s primary chip manufacturing partner despite reports that Apple could shift some orders to Intel Corp, industry experts said yesterday. The comments came after The Wall Street Journal reported on Friday that Apple and Intel had reached a preliminary agreement following more than a year of negotiations for Intel to manufacture some chips for Apple devices. Taiwan Institute of Economic Research (台灣經濟研究院) economist Arisa Liu (劉佩真) said TSMC’s advanced packaging technologies, including integrated fan-out and chip-on-wafer-on-substrate, remain critical to the performance of Apple’s A-series and M-series chips. She said Intel and Samsung
TRANSITION: With the closure, the company would reorganize its Taiwanese unit to a sales and service-focused model, Bridgestone said Bridgestone Corp yesterday announced it would cease manufacturing operations at its tire plant in Hsinchu County’s Hukou Township (湖口), affecting more than 500 workers. Bridgestone Taiwan Co (台灣普利司通) said in a statement that the decision was based on the Tokyo-based tire maker’s adjustments to its global operational strategy and long-term market development considerations. The Taiwanese unit would be reorganized as part of the closure, effective yesterday, and all related production activities would be concluded, the statement said. Under the plan, Bridgestone would continue to deepen its presence in the Taiwanese market, while transitioning to a sales and service-focused business model, it added. The Hsinchu
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has approved a capital budget of US$31.28 billion for production expansion to meet long-term development needs during the artificial intelligence (AI) boom. The company’s board meeting yesterday approved the capital appropriation plan for purposes such as the installation of advanced technology capacity and fab construction, the world’s largest contract chipmaker said in a statement. At an earnings conference last month, TSMC forecast that its capital expenditure for this year would be at the higher end of the US$52 billion to US$56 billion range it forecast in January in response to robust demand for 5G, AI and