The Ministry of Economic Affairs, the Taiwan External Trade Development Council (TAITRA), the American Institute in Taiwan (AIT) and the American State Offices Association yesterday jointly held the US Business Day investment forum at the Taipei International Convention Center as both sides gear up for more business opportunities together.
Deputy Minister of Economic Affairs Lin Chuan-neng (林全能) said in opening remarks that the Taiwan Strait issue has been a focus of global security, but foreign businesses still have confidence in Taiwan’s market, as companies such as Applied Materials Inc, ASML Holding NV and Merck Group continue to invest here.
“Taiwan is indeed a trustworthy partner in the global supply chain,” Lin was quoted as saying in a statement released by TAITRA.
Photo: Lin Jin-hua, Taipei Times
Taiwan and the US continue to strengthen economic and trade cooperation based on shared values, TAITRA chairman James Huang (黃志芳) said in the statement.
For example, US President Joe Biden last month signed into law a bill that approves the first agreement negotiated under the US-Taiwan Initiative on 21st-Century Trade, which is proof of the trust and cooperation between Taiwan and the US over the past decades, Huang said.
AIT Director Sandra Oudkirk was quoted as saying at the forum that bilateral investment between Taiwan and the US in the semiconductor, electric vehicle and 5G industries would help increase employment and economic growth on both sides, and boost cultural exchanges and business opportunities.
Many US states have established offices in Taiwan over the past three years, amid a closer relationship between Taiwan and the US, Oudkirk said, adding that 18 US companies, including Super Micro Computer Inc, attended the investment forum.
Last year, Taiwan was the US’ ninth-largest trading partner, while the US was Taiwan’s second-largest, as well as one of its most important sources of foreign direct investment and technological input, the TAITRA statement said.
This year, more than 200 Taiwanese businesses, including Lite-On Technolgy Corp (光寶科技), Compal Electronics Inc (仁寶電腦), Aerospace Industrial Development Corp (漢翔航空), Teco Electric and Machinery Co (東元電機) and Sinbon Electronics Co (信邦電子), attended the event to engage in one-on-one business meetings with US companies, it said.
Arizona Governor Katie Hobbs, who led a delegation to Taiwan for the forum, said in a speech at the event that her state is expecting more opportunities to cooperate with Taiwanese businesses following a spate of investment by firms in the Taiwanese semiconductor supply chain.
New Mexico Governor Michelle Lujan Grisham, who was also heading a delegation, spoke of the economic diversity of her state, with industrial investments focusing on green energy related to the hydrogen, aerospace, smart manufacturing, electric vehicle, information security and tourism sectors.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) secured a record 70.2 percent share of the global foundry business in the second quarter, up from 67.6 percent the previous quarter, and continued widening its lead over second-placed Samsung Electronics Co, TrendForce Corp (集邦科技) said on Monday. TSMC posted US$30.24 billion in sales in the April-to-June period, up 18.5 percent from the previous quarter, driven by major smartphone customers entering their ramp-up cycle and robust demand for artificial intelligence chips, laptops and PCs, which boosted wafer shipments and average selling prices, TrendForce said in a report. Samsung’s sales also grew in the second quarter, up
LIMITED IMPACT: Investor confidence was likely sustained by its relatively small exposure to the Chinese market, as only less advanced chips are made in Nanjing Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) saw its stock price close steady yesterday in a sign that the loss of the validated end user (VEU) status for its Nanjing, China, fab should have a mild impact on the world’s biggest contract chipmaker financially and technologically. Media reports about the waiver loss sent TSMC down 1.29 percent during the early trading session yesterday, but the stock soon regained strength and ended at NT$1,160, unchanged from Tuesday. Investors’ confidence in TSMC was likely built on its relatively small exposure to the Chinese market, as Chinese customers contributed about 9 percent to TSMC’s revenue last
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
RSS