Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) on Saturday opened an overseas operations office to supervise fabs under construction in Arizona and Japan’s Kumamoto Prefecture.
In an internal announcement, the world’s largest contract chipmaker said the office would support its global expansion and ensure high efficiency at its overseas operations.
TSMC said the office has a core management team that covers a wide range of areas, such as operations, product quality and reliability, business planning, material management, information technologies, financial and legal affairs, and human resources.
Photo: Lam Yik Fei, Bloomberg
It would work to speed up integration of the chipmaker’s overseas organization, TSMC said.
The new office is in charge of supervising and managing TSMC Arizona Corp and Japan Advanced Semiconductor Manufacturing Inc, the chipmaker said.
The company set up TSMC Arizona to build two fabs in Arizona, at which it is planning to make chips using its advanced 4-nanometer and 3-nanometer processes, with mass production scheduled to begin next year and in 2026 respectively.
Through its Japanese subsidiary, the chipmaker is building a plant in the country at which its 12-nanometer, 16-nanometer and 22-nanometer processes, as well as 28-nanometer specialty technology, would be used, with commercial production expected to start next year.
The chipmaker said the overseas operations office is jointly headed by senior vice president for operations Y.P. Chin (秦永沛), senior vice president for business development Kevin Zhang (張曉強) and senior vice president in the corporate strategy office Rick Cassidy.
Cassidy, who previously served as CEO and president of TSMC Arizona, has been appointed the subsidiary’s chairman, while the vice president for fab operations I, Y.L. Wang (王英郎), was tapped to serve as its CEO, the chipmaker said, adding that Brian Harrison was promoted from the subsidiary’s vice senior president to president.
Vice president for fab operations II Y.H. Liaw (廖永豪) has been appointed CEO of the Japanese subsidiary, while Yuichi Horita remains its president, the chipmaker said.
Hsinchu-headquartered TSMC cemented its status as the world’s largest contract chipmaker in the fourth quarter of last year, TrendForce Corp (集邦科技) said in a report last month.
The chipmaker held a 58.5 percent share in the global pure-play wafer foundry business, up 2.4 percentage points from the previous quarter, while South Korea’s Samsung Electronics Co came in second with a 15.8 percent share in the global market, ahead of Taiwan’s United Microelectronics Corp (聯電), with a 6.3 percent share, TrendForce said.
Shares in TSMC, the most heavily weighted stock in the local market, lost 0.37 percent to close at NT$533 on Friday.
They have risen 18.84 percent so far this year, Taiwan Stock Exchange data showed.
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