The TAIEX closed lower yesterday after fluctuating in consolidation mode ahead of the release of US job data later in the day.
Dealers reported that investors, awaiting clues from the upcoming job report, held off during the session, despite reduced fears after US Federal Reserve Chairman Jerome Powell struck a softer tone earlier this week.
The TAIEX ended down 0.28 percent at 14,970.68, with turnover totaling NT$223.1 billion (US$7.3 billion), lifting the TAIEX to end the week up 192.17 points from 14,778.51 points on Friday last week.
Investors took cues from a lackluster showing on the US markets, where the Dow Jones Industrial Average lost 0.56 percent and the tech-heavy NASDAQ Composite Index rose only 0.13 percent overnight ahead of the release of the US nonfarm payroll report for last month.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), the market’s most heavily weighted stock, came under pressure along with other semiconductor heavyweights.
iPhone assembler Hon Hai Precision Industry Co (鴻海精密) — second to TSMC in terms of market capitalization posted — lent some support to the broader market.
“Market sentiment seemed to have improved in recent sessions after Powell’s speech on Wednesday,” Hua Nan Securities Co (華南永昌證券) analyst Kevin Su (蘇俊宏) said. “Still, before the job data, many investors preferred to take a pause after yesterday’s rally.”
On Wednesday, Powell said the pace of interest rate increases would likely slow in the current rate hike cycle, potentially starting this month.
However, Powell cautioned that the Fed’s monetary policy was likely to stay tight for some time until signs of progress on inflation emerged.
“Since the beginning of November, the TAIEX has gained significantly, and it was no surprise that caution set in before the job data is out amid fears over a possible technical pullback,” Su said.
Before yesterday, the local main board had moved up by 2,063.05 points, or 15.93 percent, since the beginning of last month.
“TSMC fell victim to profit-taking, but fortunately, Hon Hai and its subsidiaries scored gains to offset the losses suffered by the semiconductor industry. This was due to optimism toward the company’s efforts in developing the electric vehicle business to diversify its product portfolio,” Su said.
Outperforming the broader market, Hon Hai, also known as Foxconn (富士康), gained 2.43 percent to close at NT$105.50.
At the other end of the market, TSMC lost 1.20 percent to close at NT$492.50, as the stock faced stiff technical resistance ahead of the NT$500,00 mark.
Bucking the downward trend, power management integrated circuit designer Silergy Corp (矽力杰) soared 10 percent to close at NT$544.00, and Powerchip Semiconductor Manufacturing Corp (力積電), another smaller contract chipmaker, rose 1.76 percent to end at NT$34.60.
Foreign institutional investors sold a net NT$50.52 million worth of shares on the main board yesterday, the Taiwan Stock Exchange said.
With this year’s Semicon Taiwan trade show set to kick off on Wednesday, market attention has turned to the mass production of advanced packaging technologies and capacity expansion in Taiwan and the US. With traditional scaling reaching physical limits, heterogeneous integration and packaging technologies have emerged as key solutions. Surging demand for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) chips has put technologies such as chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO), system on integrated chips (SoIC), 3D IC and fan-out panel-level packaging (FOPLP) at the center of semiconductor innovation, making them a major focus at this year’s trade show, according
DEBUT: The trade show is to feature 17 national pavilions, a new high for the event, including from Canada, Costa Rica, Lithuania, Sweden and Vietnam for the first time The Semicon Taiwan trade show, which opens on Wednesday, is expected to see a new high in the number of exhibitors and visitors from around the world, said its organizer, SEMI, which has described the annual event as the “Olympics of the semiconductor industry.” SEMI, which represents companies in the electronics manufacturing and design supply chain, and touts the annual exhibition as the most influential semiconductor trade show in the world, said more than 1,200 enterprises from 56 countries are to showcase their innovations across more than 4,100 booths, and that the event could attract 100,000 visitors. This year’s event features 17
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass