Taiwanese and US companies signed seven memorandums of understanding (MOUs) at a high-level trade meeting in Washington to enhance cooperation in fields such as renewable energy and 5G communications, the Ministry of Economic Affairs said on Thursday.
The MOUs inked during the first physical meeting under the Technology Trade and Investment Collaboration (TTIC) framework could help both countries enhance cooperation and stabilize global supply chains, said Minister of Economic Affairs Wang Mei-hua (王美花), head of the Taiwanese delegation.
Participating Taiwanese companies included state-run Taiwan Power Co (Taipower, 台電), Aerospace Industrial Development Corp (AIDC, 漢翔航空), Quanta Cloud Technology (雲達科技), HTC Corp (宏達電), TMY Technology Inc (稜研科技) and Edgecore Networks Corp (鈺登), the ministry said.
Photo: CNA
On the US side, representatives from General Electric Co (GE), Intel Corp, RingCentral Inc, Lumen Technologies and DuPont were present.
One of the MOUs involves GE helping AIDC use hydrogen-based power-generation technologies to reduce greenhouse gas emissions and develop its own maintenance capabilities on a turbine-supported electrification project, the ministry said.
GE is also to work with Taipower to achieve its goal of net zero carbon emissions by 2050, the ministry said.
The MOUs also cover information and communications technology cooperation in areas such as smart manufacturing, entertainment, healthcare and 5G connectivity, it said.
Besides attending the TTIC meeting, the first since the body was established in December last year for Taiwan and the US to develop commercial programs and bolster critical technology supply chains, Wang said her trip, which runs from Oct. 9 to tomorrow, has also facilitated exchanges between about 80 Taiwanese and US firms.
Wang said the exchanges had generated a positive response, and she believed there would be more TTIC meetings next year, although the date and location were still to be decided.
Wang was to visit companies in Silicon Valley, including Applied Materials Inc, after wrapping up her visit in Washington yesterday.
She expressed hopes that her visit could generate orders and potential investments of up to NT$30 billion (US$940.91 million).
Wang reiterated Taiwan’s critical role in the global semiconductor industry, supported by a solid industry cluster, high-quality talent and a sound legal framework for semiconductor intellectual property protection.
Any disruption to the semiconductor industry in Taiwan could have a severe impact on the global tech industry and world economy, she said, calling for stable relations between Taiwan and China.
GROWING OWINGS: While Luxembourg and China swapped the top three spots, the US continued to be the largest exposure for Taiwan for the 41st consecutive quarter The US remained the largest debtor nation to Taiwan’s banking sector for the 41st consecutive quarter at the end of September, after local banks’ exposure to the US market rose more than 2 percent from three months earlier, the central bank said. Exposure to the US increased to US$198.896 billion, up US$4.026 billion, or 2.07 percent, from US$194.87 billion in the previous quarter, data released by the central bank showed on Friday. Of the increase, about US$1.4 billion came from banks’ investments in securitized products and interbank loans in the US, while another US$2.6 billion stemmed from trust assets, including mutual funds,
AI TALENT: No financial details were released about the deal, in which top Groq executives, including its CEO, would join Nvidia to help advance the technology Nvidia Corp has agreed to a licensing deal with artificial intelligence (AI) start-up Groq, furthering its investments in companies connected to the AI boom and gaining the right to add a new type of technology to its products. The world’s largest publicly traded company has paid for the right to use Groq’s technology and is to integrate its chip design into future products. Some of the start-up’s executives are leaving to join Nvidia to help with that effort, the companies said. Groq would continue as an independent company with a new chief executive, it said on Wednesday in a post on its Web
JOINT EFFORTS: MediaTek would partner with Denso to develop custom chips to support the car-part specialist company’s driver-assist systems in an expanding market MediaTek Inc (聯發科), the world’s largest mobile phone chip designer, yesterday said it is working closely with Japan’s Denso Corp to build a custom automotive system-on-chip (SoC) solution tailored for advanced driver-assistance systems and cockpit systems, adding another customer to its new application-specific IC (ASIC) business. This effort merges Denso’s automotive-grade safety expertise and deep vehicle integration with MediaTek’s technologies cultivated through the development of Media- Tek’s Dimensity AX, leveraging efficient, high-performance SoCs and artificial intelligence (AI) capabilities to offer a scalable, production-ready platform for next-generation driver assistance, the company said in a statement yesterday. “Through this collaboration, we are bringing two
Even as the US is embarked on a bitter rivalry with China over the deployment of artificial intelligence (AI), Chinese technology is quietly making inroads into the US market. Despite considerable geopolitical tensions, Chinese open-source AI models are winning over a growing number of programmers and companies in the US. These are different from the closed generative AI models that have become household names — ChatGPT-maker OpenAI or Google’s Gemini — whose inner workings are fiercely protected. In contrast, “open” models offered by many Chinese rivals, from Alibaba (阿里巴巴) to DeepSeek (深度求索), allow programmers to customize parts of the software to suit their
RSS