The US Federal Aviation Administration (FAA) on Monday said it is satisfied with changes Boeing Co has made in the production of its 787 Dreamliner passenger jet, clearing the way for the company to resume deliveries.
American Airlines Group Inc said it expects to get its first new 787 in more than 15 months as early as Wednesday.
The FAA announcement confirmed reports late last month and came days after the agency’s acting chief met with safety inspectors who oversee Boeing.
                    Photo: Reuters
It said Acting FAA Administrator Billy Nolen wanted to hear about steps Boeing has taken to fix manufacturing problems and ensure independence for employees who work with regulators.
Production of the big, two-aisle 787 has been marred by several problems, including gaps between panels of the carbon-composite skin, and use of unapproved titanium parts from a supplier in Italy.
Those issues prevented Boeing from delivering any of the planes for most of the past two years, and about 120 have been parked while Boeing tried to fix the production process.
The FAA said it would inspect each plane before it is approved for delivery.
American Airlines was hit particularly hard by the halt in deliveries. Earlier this year, it delayed some planned international flights, because Boeing was not able to deliver the planes on schedule.
The airline on Monday said that its newest 787 would come from a Boeing factory in South Carolina and is expected to begin carrying passengers “in the coming weeks.”
It said that would make 47 active 787s in its fleet, with another 42 on order.
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would