Taiwan Business Bank (台灣企銀) yesterday said it is seeking to improve profitability this year by expanding loans to small and medium enterprises (SMEs) and overseas operations as they generate higher margins.
The state-run lender made the announcement after posting NT$2.12 billion (US$72.74 million) in net income for the first quarter — its highest in two-and-a-half years — or earnings per share of NT$0.27.
The lender’s efforts to enhance asset quality and diversify sources of income have started to pay off, bank officials told an online investors’ conference, adding that increases in wealth management and fee income helped offset losses linked to volatile financial markets.
Photo: Chen Mei-ying, Taipei Times
The uptrend is expected to continue for the rest of this year, benefiting from monetary tightening cycles at home and abroad, the officials said.
As of March, lending to small and medium-sized enterprises totaled NT$66.85 billion, an increase of 10.04 percent from a year earlier, they said, adding that the business would continue to provide momentum to loan growth this year.
Interest spread widened from 1.31 percent in March to 1.42 percent last month, following the central bank’s interest rate hike of 25 basis points on March 17, the officials said.
The gap would increase if the central bank raises interest rates later this year, in line with global peers, they added.
Taiwan Business Bank said it would hold mortgage operations steady by focusing on first-home buyers and people with real demand, while supporting selective credit controls on multiple-home mortgages.
Banks intent on active mortgage lending would have to demonstrate higher capital adequacy to meet stricter risk requirements.
Taiwan Business Bank said it would also work toward improving business at its branches in Australia, China, Hong Kong and the US, with the aim of boosting their revenue contributions to 20 percent this year.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is accelerating capacity expansion fivefold this year, but it is still unable to keep up with the booming demand for artificial intelligence (AI), TSMC deputy cochief operating officer Cliff Hou (侯永清) said yesterday. This year alone, the company is building 25 chip manufacturing fabs and advanced packaging facilities worldwide, including 13 plants in Taiwan, which is unprecedented, Hou said at a CEO Summit fireside chat at Semicon Taiwan in Taipei. In the past, the company was able to build five or six factories a year, said Hou, who is also chairman of the Taiwan Semiconductor Industry
EXPANSION: The 3-hectare site would include small clean rooms and laboratories as well as a world-class training base for advanced packaging talent, the company said Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is to establish a presence in the Baipu Industrial Park (白埔產業園區) in Kaohsiung to accelerate the testing and validation of semiconductor materials and equipment, a company executive said on Tuesday. The company is working with the Ministry of Economic Affairs and the Kaohsiung City Government on the plan, which is expected to improve validation efficiency by 25 to 50 percent, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC global summit held ahead of the Semicon Taiwan trade show, which opened in Taipei yesterday. TSMC would also conduct
Visitors look at a 64-qubit superconducting quantum computer on display at the Fujitsu booth at the Semicon Taiwan trade show in Taipei yesterday.
Silicon photonics would play a dominant role next year and make chip-level co-packaged optics (CPO) packaging possible, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. “For years, critics questioned the reliability of CPO. The doubts are being thoroughly dismantled by real-world data and market validation,” TSMC vice president of advanced packaging technology development K.C. Hsu (徐國晉) said at a SEMI forum in Taipei. The company is on track to enter production of CPO later this year, Hsu said in another forum arranged by Imec in Taipei yesterday, about four months after TSMC announced its progress in CPO development in May.