Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is planning to boost this year’s capital expenditure budget by about 46 percent to exceed US$44 billion, citing strong customer demand for advanced technologies used in high-performance computing (HPC) and 5G-related applications, the world’s largest contract chipmaker said yesterday.
The plan marks a record spending for TSMC after the chipmaker budgeted US$30 billion for capacity expansions at home and overseas fabs last year.
TSMC is planning to allocate about 80 percent of this year’s capital spending for advanced chip capacity expansion including 2-nanometer, 3-nanometer, 5-nanometer and 7-nanometer technologies.
Photo: I-Hwa Cheng, Bloomberg
The chipmaker reiterated that it is on track to ramp up 3-nanometer production in the second half of this year, dismissing speculation about a delay.
The chipmaker is seeing more customer interest in semiconductors using 3-nanometer technology than 5-nanometer chips, the most advanced chips available currently.
“We expect 2022 to be another strong growth” period, TSMC chief executive officer C.C. Wei (魏哲家) told a quarterly investors’ teleconference yesterday.
“We are confident we can outperform foundry [sector] growth,” he said, setting a growth target of 25 to 29 percent.
The chipmaker would this year benefit from “a structural increase in demand fueled by HPC, accelerated digitalization and short-term chip supply imbalance because of COVID-19 and geopolitical tensions,” Wei said.
The revenue forecast factored in that one of its customers, an integrated device manufacturer linked to Intel Corp, is “insourcing” production after re-entering the foundry sector, TSMC said.
The chipmaker expects its capacity to remain tight through this year, given the increased use of chips in vehicles, PCs, servers, networking devices and smartphones.
Forecasting robust growth momentum, the chipmaker expects customer prepayment to pick up this year, after it last year received prepayments totaling US$6.7 billion.
TSMC expects the growth momentum to extend into the next few years, with revenue to expand at an annual compound growth rate of 15 to 20 percent.
HPC applications would grow at the fastest pace with robust demand for CPU, GPU and artificial intelligence accelerators, the chipmaker said.
TSMC raised its forecast for gross margin over the next few years to above 53 percent from 50 percent forecast earlier.
This quarter, gross margin would improve to 53 to 55 percent from 52.7 percent last quarter, it said.
Revenue is to expand more than 7 percent to US$16.6 billion to US$17.2 billion from the previous quarter, beating Goldman Sachs Group Inc’s forecast of a quarterly growth of 3.7 percent.
“Moving into the first quarter of 2022, we expect our business to be supported by HPC-related demand, continued recovery in the automotive segment and a milder smartphone seasonality than in recent years,” TSMC chief financial officer Wendell Huang (黃仁昭) said.
For the final quarter of last year, the chipmaker posted a profit increase of 16.4 percent to a record NT$166.23 billion (US$6.01 billion), compared with NT$142.77 billion a year earlier.
On a quarterly basis, net profit increased 6.4 percent from NT$156.26 billion, it said.
For the whole of last year, TSMC’s net profit rose about 15 percent to NT$596.54 billion from NT$517.89 billion in 2020.
Earnings per share were NT$23.01, up from NT$19.97 the previous year, it said.
RESERVES ADEQUATE: The central bank governor rejected claims that Taiwan was facing a cash shortage, saying that its financial system had ample savings The New Taiwan dollar’s 3 percent fall this year despite record exports and a widening trade surplus stems from foreign investors cashing in on the local stock market’s technology-driven rally and moving funds overseas, central bank Governor Yang Chin-long (楊金龍) told lawmakers yesterday. The NT dollar has become one of Asia’s weakest-performing major currencies this year. Foreign investors have reaped substantial gains from Taiwan’s surging stock market, prompting them to sell shares and rebalance their portfolios, Yang told a meeting of the legislature’s Finance Committee in Taipei. Their withdrawals have added to downward pressure on the NT dollar, offsetting support
‘ON SCHEDULE’: Chief executive officer Rick Tsai said that TSMC ‘remains our most important partner’ as MediaTek seeks to meet robust customer demand Chip designer MediaTek Inc (聯發科) yesterday said it has secured a second customer for its customized artificial intelligence (AI) accelerator for data centers, while volume production of a second-generation chip for an existing customer is on track for early 2028, potentially easing market concerns about possible delays. This is a new customer and, crucially, not from China, MediaTek said. The remarks were meant to dismiss speculation that ByteDance Ltd (字節跳動), the parent company of TikTok, was the second customer for MediaTek’s new customized AI application-specific integrated circuit (ASIC) business. “It is on track, on schedule. We understand there is some noise about the
The artificial intelligence (AI) supercycle should last for more than two decades, former Intel Corp chief executive officer Pat Gelsinger told an event in Taipei yesterday, dismissing fears of an AI bubble amid mounting skepticism over massive infrastructure investments. “We do see that there will be periods of disruption, correction, etc. So, we do not think of it as an AI bubble,” Gelsinger, who is a general partner at Playground Global LLC, said at the US venture capital firm’s second annual Taiwan Deep Tech Summit. However, “we’ll have some speed bumps as different areas and different technology disruptions occur along it,” Gelsinger
ROOM TO GROW: The company’s biggest bottleneck is still space, chief financial officer Joseph Tung said, adding that it was scouting existing factories to acquire ASE Technology Holding Co (日月光投控) yesterday raised its annual capital expenditure budget for the third time to US$11.5 billion, driven by expectations that customer demand next year would continue to outpace capacity, particularly for its leading-edge advanced packaging (LEAP) technologies used in artificial intelligence (AI) chips. ASE, the world’s biggest chip packaging and testing service provider, plans to add US$1 billion to its US$10.5 billion outlay on capacity expansion. About 60 percent of the US$500 million equipment budget would be allocated for LEAP and 40 percent for mainstream packaging technology capacity, ASE chief financial officer Joseph Tung (董宏思) told an online investors’