Japan’s Toshiba Corp walked away from potential private equity buyout offers at a substantial premium, as well as advanced talks for a minority stake from Canada’s Brookfield Asset Management Inc, three people familiar with the matter said.
Toshiba’s decision to not pursue either course — some details of which have not been previously reported — and instead focus on a plan to split itself in three, has widened the gulf between the conglomerate and a number of its hedge fund investors, said the people, all of whom declined to be identified because of the sensitivity of the issue.
Some investors take issue with Toshiba’s idea that a three-way split would create greater value than a private equity deal, given that the company never formally solicited buyout bids, the people said.
Photo: Reuters
As such, some investors question the transparency of Toshiba’s ongoing strategic review, they said.
At least one private equity firm told the Toshiba committee tasked with its strategic review that a deal to take it private could be done at ¥6,000 a share or more, two people briefed on the review process said.
Another private equity firm told the committee a deal could be done at about ¥5,000 a share, one of the people briefed on the review and another person said.
A price of ¥6,000 would value Toshiba at about ¥2.6 trillion (US$22.97 billion) and represent a 32 percent premium to its average price over the past 200 days, Refinitiv data showed.
It would also be in line with the ¥6,000 range that some major shareholders, including hedge fund Elliott Management Corp, have estimated as fair.
The Toshiba committee last month said that it had asked four private equity firms at what price a potential deal to go private could happen.
The range of prices it received was “not compelling relative to market expectations,” it said in a statement, without specifying the range or elaborating on market expectations.
Multiple sources have said that the firms included KKR & Co and Bain Capital LP.
“We are communicating with shareholders explaining the separation plan we announced on Nov. 12, as well as listening to their opinions,” Toshiba said in a statement. “We will continue our communications with various stakeholders.”
Paul Brough, the outside director who heads the committee, told investors that splitting Toshiba was “the best alternative,” and the committee would not change its mind even if the price levels were made public, a transcript of a Nov. 15 meeting with investors seen by Reuters showed.
Asked by an investor whether shareholders could “have a voice in the process,” Brough said the committee hoped shareholders would agree that the break-up offered greater value.
Reached via a Toshiba spokesperson, Brough confirmed his comments in the transcript, but declined to comment further.
Some shareholders have also taken issue with Toshiba’s decision not to pursue talks with Canada’s Brookfield, one of the private equity firms, on a potential minority investment, several sources said.
That could have seen Brookfield, which successfully turned around the conglomerate’s bankrupt nuclear power business Westinghouse Electric Co LLC, take a minority stake and help overhaul the business, sources said.
Brookfield did not immediately respond to a request for comment.
Toshiba’s review committee has said it held more than 25 meetings with an unnamed “party,” but the suggested transaction was ultimately deemed as “challenging” for shareholders to support.
Toshiba is now conducting interviews with shareholders through investor relations advisory firm Makinson Cowell Ltd to solicit opinions on the break-up, sources said.
A Toshiba source, who declined to be identified, said it appeared that some hedge fund investors would not ever be won over to the break-up plan.
“Certain shareholders would never be satisfied unless we agree to be taken private,” the Toshiba source said.
AVOIDING CONFUSION: Passengers are to be able to check in two items of luggage, while the free weight allowance is to be increased to conform with other airlines EVA Airways Corp (長榮航空) yesterday announced that from June 23 it is to adopt a new baggage allowance policy for all passengers with a higher weight limit as it aims to benefit passengers and increase efficiency. The airline currently has a two-system baggage policy: It allows passengers flying to the US and Canada to check in two pieces of baggage with a free weight allowance, while for those flying to Asia, Europe and Oceania there is also a free weight allowance, but no limit on the number of pieces of baggage. From June 23, passengers would be able to check in two
MORE THAN BUZZ: The chip designer said it has received numerous orders from automakers to supply 5G modem chips, as it works to expand beyond smartphones MediaTek Inc (聯發科) yesterday said it would ship the first 5G chips for vehicles to customers in the Asia-Pacific region by the end of the year, as it moves to expand the reach of its 5G chips beyond smartphones. The Hsinchu-based chip designer said it has been developing 5G chips for connected vehicles over the past few years, targeting applications such as telematics and in-vehicle information systems. “We are seeing demand for 5G technology from numerous makers of connected cars, including electric vehicle makers. We have obtained numerous orders from automakers to supply 5G modem chips with highly integrated features,” J.C. Hsu
Qualcomm Inc yesterday said it would maintain its supply chain strategy of sourcing chips from multiple foundry partners, including advanced chips from two major suppliers, to ensure a sufficient chip supply amid the COVID-19 pandemic. Qualcomm is reportedly working with Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) and Samsung Electronics Co on advanced products, such as 4-nanometer chips, for its new flagship 5G chips, the Snapdragon 8+ Gen 1 series. Qualcomm is sourcing chips made by mature technologies from several foundry partners, the company said. Alex Katouzian, general manager of Qualcomm Technologies Inc’s mobile, compute and XR business, told a virtual media briefing that
US DRAM maker Micron Technology Inc is set to install the industry’s most cutting-edge technology — extreme ultraviolet (EUV) lithography equipment — in its facility in Taichung this year, the company said yesterday. In early preparation for the volume production of 1-gamma nanometer node DRAM, “we plan to introduce EUV tools to our Taichung fab later this year,” Micron president and chief executive officer Sanjay Mehrotra said via video at the Computex trade show in Taipei. Gamma refers to the dimension of half the distance between cells in a DRAM chip. Micron is also looking forward to beginning mass production of its